Foundry 3D Packaging Engineer

Advanced Micro Devices; Austin (TX); On-site; USD 120,000 - 170,000; Full time

Job summary

Advanced Micro Devices in Austin, TX, seeks an experienced Advanced Packaging Engineer to drive technology development of 3D package architectures. You will execute proof of concept, bring up products, and improve yield and reliability to meet performance and cost goals.

The candidate should have hands‑on BEOL/TSV and Hybrid bonding experience, strong design/reliability skills, and excellence in communication with partners and stakeholders. This role is hybrid and visa‑not‑sponsored.

Qualifications

• Experience with BEOL process, TSV integration and Hybrid bonding.
• Strong knowledge in design and reliability concepts (TV design, CPI, thermo‑mechanical analysis, DFR).
• Proficiency in advanced packaging techniques (fan‑out, 3D stacking, 2.5D, MCM).
• Industry experience with strong problem solving and communication skills.

Responsibilities

• Drive/participate in defining FMEA, TV Design, DFM, and DFY; manage DOE plans and execute material/process validation; define quality and reliability tests.
• Partner with AMD architects, designers, and product owners to develop high yielding, cost‑effective solutions and transfer into high‑volume manufacturing.
• Enable development partners to bring up new packaging technology/process from concept to NPI and prototyping to mass production.

Skills

BEOL integration

TSV integration

Hybrid bonding

Design & reliability

Packaging techniques

Communication & presentation

Education

M.S./Ph.D. in materials, mechanical, chemical, or electrical engineering

Job description

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believetechnology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMDis shapingthefuture.

Whetheryou’redesigning next-gen processors, enabling AI breakthroughs, orbringing leading edge products to market, every role at AMD contributes to something bigger— technologythat moves the world forward.Join us and, together, we’ll advance your career.

THE ROLE

As part of the AMD's Advanced Packaging team, you will drive technology development of advanced 3D package architectures. The scope includes but not limited to: execute and coordinate proof of concept on new technology; product bring up and continue yield and reliability improvement to meet performance, cost, and schedule requirements to support new AMD products.

THE PERSON

The candidate should have a proven track record and extensive knowledge and experience in wafer process Integration, such as BEOL Integration, 3D integration with TSV (through silicon via) and Hybrid Bonding (CoW and W2W) etc. The candidate should have a hands‑on approach to process bring up and development as well as excellent oral and written communication skills to communicate ideas with Foundry Partners, Suppliers, Internal Stakeholders and AMD Management.

KEY RESPONSIBILITIES

• Drive/participate in defining FMEA (failure mode effects analysis), TV Design, DFM (design for manufacturing), and DFY (design for yield). Manage DOE (design of experiments) plan and execution for material selections, process window validation. Defining quality and reliability tests including defect detection and FA (failure analysis) methodology
• Partner with AMD architects, designers, and product owners to develop high yielding, cost-effective solutions which meet product requirements. Transfer the new product into a high yielding, cost-effective, high‑volume manufacturing environment.

Enable development partners in the AMD Ecosystem to bring up new packaging technology/process from concept to NPI and prototyping to mass production. lead and perform process optimization, yield and reliability improvement.

PREFERRED EXPERIENCE

• Fundamental knowledge and experience with BEOL (Back End of Line) process, TSV integration and Hybrid bonding process and defect metrology.
• Strong knowledge and experience in design and reliability, such as TV design, CPI, Thermo‑mechanical analysis, DFR (design for reliability) etc.
• Strong knowledge with Advanced Packaging Techniques, including fan‑out, 3D stacking, 2.5D and MCM (multi chip module) packaging techniques.
• Experience in the industry with strong problem solving, communication, organizational, interpersonal, and presentation skills.

ACADEMIC CREDENTIALS

• Master of Science/PhD in materials, mechanical, chemical, or electrical engineering.

This role is not eligible for visa sponsorship.

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Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee‑based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.