3D Packaging Engineer — Hybrid (TSV/3D Integration)

AMD; Austin (TX); Hybrid; USD 120,000 - 180,000; Full time

Benefits offered by this job

Hybrid work arrangement

AMD benefits

Job summary

AMD’s Advanced Packaging team seeks a senior engineer to drive technology development of advanced 3D package architectures in Austin. Responsibilities include process bring-up, yield and reliability improvement to meet performance, cost and schedule targets.

The ideal candidate has hands-on experience with BEOL, TSV, and hybrid bonding, plus strong communication with foundry partners and internal stakeholders. Visa sponsorship is not available.

Qualifications

• Master's or PhD in materials, mechanical, chemical, or electrical engineering.

Responsibilities

• Define FMEA, TV Design, DFM, and DFY; plan and execute DOE for material and process validation.
• Collaborate with AMD architects, designers and product owners to deliver high-yield, cost-effective solutions; transfer to high-volume production.
• Enable development partners from concept to NPI and prototyping to mass production; lead process optimization and reliability improvements.

Skills

Wafer process integration

BEOL integration

3D integration

Hybrid bonding

DOE planning

FMEA

Design for yield

Education

Master's or PhD in materials, mechanical, chemical, or electrical engineering

Tools

Defect metrology

Process characterization tools

Job description

AMD’s Advanced Packaging team seeks a senior engineer to drive technology development of advanced 3D package architectures in Austin. Responsibilities include process bring-up, yield and reliability improvement to meet performance, cost and schedule targets.

The ideal candidate has hands-on experience with BEOL, TSV, and hybrid bonding, plus strong communication with foundry partners and internal stakeholders. Visa sponsorship is not available.