2.5D/3D Advanced Packaging Engineer

Broadcom; San Jose (CA); On-site; USD 140,000 - 200,000; Full time

Benefits offered by this job

Medical, dental and vision plans

401(K) with company match

Employee stock purchase program

Job summary

Broadcom invites applications for an Advanced Package Technology Engineer in San Jose. The role focuses on 2.5D/3D packaging, leading cross-functional teams, and driving new design wins with external partners to meet high-performance, reliable packaging requirements.

Candidates should hold a Master’s in engineering with 6+ years of relevant experience and 4–6 years in 2.5D/3D development, plus hands-on CAD tools proficiency.

Qualifications

• Master's degree in Mechanical/Electrical/Electronics with 6+ years in advanced packaging.
• 4–6 years hands-on in 2.5D/3D development.
• Deep knowledge of silicon fab, bumping, interposers, BOM, thermal and mechanical interactions.

Responsibilities

• Provide deeper expertise in 2.5D/3D technology and define unified solutions.
• Lead identification, development and qualification with external partners.
• Engage memory suppliers to define tech and quality requirements.
• Interface with Pkg Design, Test Dev and other teams as part of the cross-functional team.
• Support new design wins, NPI and volume ramps.
• Develop alternate sourcing and qualification.

Skills

2.5D/3D packaging

Program management

Cross-functional collaboration

Thermal & mechanical analysis

CAD tools: APD AutoCAD SolidWorks

Education

Master's degree in Mechanical/Electrical/Electronics

Tools

APD

AutoCAD

SolidWorks

Job description

Broadcom invites applications for an Advanced Package Technology Engineer in San Jose. The role focuses on 2.5D/3D packaging, leading cross-functional teams, and driving new design wins with external partners to meet high-performance, reliable packaging requirements.

Candidates should hold a Master’s in engineering with 6+ years of relevant experience and 4–6 years in 2.5D/3D development, plus hands-on CAD tools proficiency.