IC Packaging Architect: Lead Next-Gen Architecture & Yield

Advanced Micro Devices; Austin (TX); Hybrid; USD 150,000 - 190,000; Full time

Benefits offered by this job

AMD benefits

Job summary

Advanced Micro Devices in Texas seeks an engineering leader to define and drive advanced packaging architectures across client, server, gaming, and GPU products. You will steer concept-to-qualifications, collaborate with design teams and partners, and address yield, reliability, and process development challenges.

The role requires strong leadership, clear communication, and a track record in semiconductor technology development.

Qualifications

• Proven track record of driving technology development in semiconductor field.
• Leadership experience driving engineering teams in architecture definition, process definition and/or yield improvement.
• Excellent oral and written communication skills to share complex signals with partners and management.

Responsibilities

• Work with product architects in early definition stage to understand and define package architectures, roadmap
• Lead new package technology development initiatives from concept to full technology qualification
• Drive Test vehicle design and manufacturing to establish design rules, DFM/DFY guidelines
• Establish Yield roadmap and lead implementation of yield, data analytic tools as needed

Education

BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering or equivalent

Job description

Advanced Micro Devices in Texas seeks an engineering leader to define and drive advanced packaging architectures across client, server, gaming, and GPU products. You will steer concept-to-qualifications, collaborate with design teams and partners, and address yield, reliability, and process development challenges.

The role requires strong leadership, clear communication, and a track record in semiconductor technology development.