Optical Interconnect Packaging Engineer (2.5D/3D/3.5D)

MediaTek; San Jose (CA); On-site; USD 188,000 - 356,000; Full time

Benefits offered by this job

Comprehensive health insurance

401K

Parental leave

Vacation time

Sick leave

Job summary

MediaTek is seeking an experienced technologist in San Jose to contribute to the development of optical interconnect packaging and advanced packaging solutions.

The role requires collaboration with internal teams and technology providers to drive projects from proof of concept to high volume production, managing challenges along the way. The ideal candidate has a relevant advanced degree and extensive experience in optical device development.

Benefits include comprehensive health coverage, performance bonuses, and generous time-off policies.

Qualifications

• 5+ years’ experience in relevant fields.
• Excellent communication and presentation skills in English.
• Proven ability to hands-on debug.

Responsibilities

• Develop and validate optical interconnect packaging solutions.
• Collaborate with various engineering teams to deliver technology.
• Conduct DFM analysis and generate design rule sets.

Skills

Optical device development

Optical alignment process development

Project management

Problem-solving

Cross-functional collaboration

Education

MS/PhD degree in Mechanical Engineering, Optical Engineering, Material Science

Job description

MediaTek is seeking an experienced technologist in San Jose to contribute to the development of optical interconnect packaging and advanced packaging solutions.

The role requires collaboration with internal teams and technology providers to drive projects from proof of concept to high volume production, managing challenges along the way. The ideal candidate has a relevant advanced degree and extensive experience in optical device development.

Benefits include comprehensive health coverage, performance bonuses, and generous time-off policies.