Advanced Packaging Development Engineer

Broadcom Inc.; Irvine (CA); On-site; USD 122,000 - 203,000; Full time

Job summary

Broadcom Inc. in Irvine, California, seeks a seasoned packaging technology professional to develop and enable advanced packaging to integrate memory dies and SoC dies for AI-related products. You will lead roadmap, support HBM/iVR/SiCap components, manage reliability testing, and drive yield improvements.

The role demands extensive 2.5D/3D packaging experience, strong PM skills, and a drive for technology innovation. Competitive compensation and comprehensive benefits are offered.

Qualifications

• 10+ years of post-degree experience in 2.5D/3D packaging or HBM tech.
• Strong project management and teamwork skills.
• Proven ability in technology innovation and enablement.
• MS in Engineering; PhD reduces required experience to 7 years.

Responsibilities

• Develop a packaging technology roadmap for 3–5 years.
• Support development of HBM, iVR, SiCap components.
• Manage reliability testing for new technology.
• Lead yield improvement during technology ramp.

Skills

2.5D/3D packaging

HBM tech development

Reliability improvements

Project management

Teamwork

Innovation

Education

MS in Engineering

Job description

Job Overview

Broadcom is a leading semiconductor company with a rapidly growing business in AI accelerators and networking chips. We are hiring a professional to develop and enable advanced packaging technology to integrate memory dies and SoC dies into one package for AI‑related products.

Key Responsibilities

• Develop a packaging technology roadmap to meet future product needs for 3‑5 years.
• Support the development of key components (HBM, iVR, SiCap) for advanced packaging.
• Manage reliability testing to qualify new technology.
• Lead yield improvement activities for new technology ramp‑up.

Qualifications

• Intensive experience in related areas such as 2.5D/3D and HBM technology development and reliability/yield improvements.
• Project management and teamwork skills.
• Strong aptitude for technology innovation, development, and enablement.
• MS degree in a related engineering field with at least 10 years (post‑degree) of direct experience, or 7 years with a PhD.

Compensation and Benefits

The annual base salary range for this position is $127,100–$203,400. The position is also eligible for a discretionary annual bonus in accordance with relevant plan documents and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package, including medical, dental, and vision plans; 401(k) participation with company matching; Employee Stock Purchase Program (ESPP); Employee Assistance Program (EAP); company‑paid holidays; paid sick leave and vacation time. The company follows all applicable laws for paid family leave and other leaves of absence.

Equal Employment Opportunity

Broadcom is proud to be an equal‑opportunity employer. We consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status, or any other characteristic protected by federal, state, or local law. We also consider qualified applicants with arrest and conviction records consistent with local law.