Advanced Package Technology Engineer

Broadcom; Fort Collins (CO); On-site; USD 120,000 - 180,000; Full time

Job summary

Broadcom in Fort Collins, CO is seeking an Advanced Package Technology Engineer to drive high-performance 2.5D/3D packaging solutions. You will collaborate with silicon and package design, marketing, NPI, and suppliers to meet signal integrity, thermal, and reliability goals.

Requirements include a Master’s in Mechanical, Electrical or Electronics Engineering with 6+ years of relevant experience (or PhD with 3+ years).

Qualifications

• Master’s degree with 6+ years in advanced packaging environments.
• In-depth knowledge of 2.5D/3D packaging, interposers, substrates, BOM definition.
• Experience with thermal and mechanical modelling and CAD tools.
• Ability to engage with external suppliers and cross-functional teams.]
• Willingness to travel periodically.

Responsibilities

• Provide deeper expertise in 2.5D/3D technology and drive unified solutions.
• Lead identification, development & qualification with external assembly partners.
• Engage memory suppliers to define technology and quality requirements.
• Interface with DI, Pkg Design, Test Dev and other teams as part of a cross-functional group.
• Support new design wins, NPI and volume ramps.
• Develop alternate sourcing & qualification.

Skills

Project management

Problem solving

Interpersonal skills

Travel readiness

Education

Master's Degree in Mechanical / Electrical / Electronics Engineering

PhD (with 3+ years)

Tools

APD

AutoCAD

Solidworks

Job description

Job Description

As part of WW ASIC product development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost effective high performance, advanced custom package solutions achieving signal integrity, thermal, structural reliability, substrate fab/package assembly design rules & project schedule requirements.

• 2.5D & 3D is cutting edge package technology with BRCM’s needs pushing the technology limits.

Job Scope (Advanced Package Technology Engineer)

• –Provide deeper expertise in 2.5D / 3D technology; current and future customer engagement on technology needs & updates, consolidation of requirements and drive towards unified solution.
• –Lead in identification, development & qualification; program management with external assembly partners
• –Lead in memory supplier(s) engagement to define technology and quality requirements.
• –Interface with other technical teams (DI, Pkg Design, Test Dev) etc. as part of Cross Functional Team.
• –Support new design wins, NPI and volume ramps.
• –Develop alternate sourcing & qualification.

Basic

Master's Degree in Mechanical / Electrical / Electronics Engineering with 6+ years of relevant experience in developing cost effective, high performance (speed, density, pin count, thermal & reliable), single & multi-chip, large, complex, custom & fine pitch flip chip packaging solution with advanced multi-layer ceramic / organic substrates & Interposers; Standard & thermally enhanced fine pitch leaded & BGA wire bond & wafer level packaging solution; or PhD with 3+ years of relevant experience

Specific

4:6 years Hands On experience in 2.5D / 3D Development; In-depth Know-how of Advanced Silicon fab, Bump, Interposer, substrate & assembly processes, materials & supplier selection, BOM definition, thermal and mechanical interactions.

Others

• –Sound knowledge of & hands on experience in advanced, prevailing and emerging silicon, package & substrate technologies, bumping and assembly processes, design rules, failure analysis tools and techniques, materials and equipment, applicable industry standards, regulations & quality systems.
• –Good team player with project management, analytical, problem-solving and interpersonal skills. Must be self-driven, flexible and agile, result oriented individual. Ability to develop concepts into structured projects, generate new and innovative solutions to complex problems and handle multiple programs concurrently.
• –Hands-on experience of use of modelling (Thermal & Mechanical) & Sub / PCB Design CAD tools (APD, AutoCAD, Solidworks etc) for design optimization.
• –Sound knowledge of advanced node silicon fabrication, PCB technologies and board assembly processes, applicable industry standards, quality systems and regulations.
• –Communicate extensively with internal and external team members, customers in various global locations and may require travel from time to time.

Compensation And Benefits

The annual base salary range for this position is To

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

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