Advanced 2.5D/3D Package Engineer - Equity Eligible

Broadcom; Fort Collins (CO); On-site; USD 120,000 - 180,000; Full time

Job summary

Broadcom in Fort Collins, CO is seeking an Advanced Package Technology Engineer to drive high-performance 2.5D/3D packaging solutions. You will collaborate with silicon and package design, marketing, NPI, and suppliers to meet signal integrity, thermal, and reliability goals.

Requirements include a Master’s in Mechanical, Electrical or Electronics Engineering with 6+ years of relevant experience (or PhD with 3+ years).

Qualifications

• Master’s degree with 6+ years in advanced packaging environments.
• In-depth knowledge of 2.5D/3D packaging, interposers, substrates, BOM definition.
• Experience with thermal and mechanical modelling and CAD tools.
• Ability to engage with external suppliers and cross-functional teams.]
• Willingness to travel periodically.

Responsibilities

• Provide deeper expertise in 2.5D/3D technology and drive unified solutions.
• Lead identification, development & qualification with external assembly partners.
• Engage memory suppliers to define technology and quality requirements.
• Interface with DI, Pkg Design, Test Dev and other teams as part of a cross-functional group.
• Support new design wins, NPI and volume ramps.
• Develop alternate sourcing & qualification.

Skills

Project management

Problem solving

Interpersonal skills

Travel readiness

Education

Master's Degree in Mechanical / Electrical / Electronics Engineering

PhD (with 3+ years)

Tools

APD

AutoCAD

Solidworks

Job description

Broadcom in Fort Collins, CO is seeking an Advanced Package Technology Engineer to drive high-performance 2.5D/3D packaging solutions. You will collaborate with silicon and package design, marketing, NPI, and suppliers to meet signal integrity, thermal, and reliability goals.

Requirements include a Master’s in Mechanical, Electrical or Electronics Engineering with 6+ years of relevant experience (or PhD with 3+ years).