Advanced Package Technology Engineer

Broadcom; San Jose (CA); On-site; USD 140,000 - 200,000; Full time

Benefits offered by this job

Medical, dental and vision plans

401(K) with company match

Employee stock purchase program

Job summary

Broadcom invites applications for an Advanced Package Technology Engineer in San Jose. The role focuses on 2.5D/3D packaging, leading cross-functional teams, and driving new design wins with external partners to meet high-performance, reliable packaging requirements.

Candidates should hold a Master’s in engineering with 6+ years of relevant experience and 4–6 years in 2.5D/3D development, plus hands-on CAD tools proficiency.

Qualifications

• Master's degree in Mechanical/Electrical/Electronics with 6+ years in advanced packaging.
• 4–6 years hands-on in 2.5D/3D development.
• Deep knowledge of silicon fab, bumping, interposers, BOM, thermal and mechanical interactions.

Responsibilities

• Provide deeper expertise in 2.5D/3D technology and define unified solutions.
• Lead identification, development and qualification with external partners.
• Engage memory suppliers to define tech and quality requirements.
• Interface with Pkg Design, Test Dev and other teams as part of the cross-functional team.
• Support new design wins, NPI and volume ramps.
• Develop alternate sourcing and qualification.

Skills

2.5D/3D packaging

Program management

Cross-functional collaboration

Thermal & mechanical analysis

CAD tools: APD AutoCAD SolidWorks

Education

Master's degree in Mechanical/Electrical/Electronics

Tools

APD

AutoCAD

SolidWorks

Job description

USA-Colorado-Fort Collins-4380 Ziegler Road

USA-CA San Jose Innovation Drive

Full time

R024784

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Job Description:

As part of WW ASIC product development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost effective high performance, advanced custom package solutions achieving signal integrity, thermal, structural reliability, substrate fab/package assembly design rules & project schedule requirements. •2.5D & 3D is cutting edge package technology with BRCM’s needs pushing the technology limits.

Job Scope (Advanced Package Technology Engineer)

–Provide deeper expertise in 2.5D / 3D technology; current and future customer engagement on technology needs & updates, consolidation of requirements and drive towards unified solution.

–Lead in identification, development & qualification; program management with external assembly partners

–Lead in memory supplier(s) engagement to define technology and quality requirements.

–Interface with other technical teams (DI, Pkg Design, Test Dev) etc. as part of Cross Functional Team.

–Support new design wins, NPI and volume ramps.

–Develop alternate sourcing & qualification.

Basic : Master's Degree in Mechanical / Electrical / Electronics Engineering with 6+ years of relevant experience in developing cost effective, high performance (speed, density, pin count, thermal & reliable), single & multi-chip, large, complex, custom & fine pitch flip chip packaging solution with advanced multi-layer ceramic / organic substrates & Interposers; Standard & thermally enhanced fine pitch leaded & BGA wire bond & wafer level packaging solution; or PhD with 3+ years of relevant experience

Specific : 4~6 years Hands On experience in 2.5D / 3D Development; In-depth Know-how of Advanced Silicon fab, Bump, Interposer, substrate & assembly processes, materials & supplier selection, BOM definition, thermal and mechanical interactions.

Others:

–Sound knowledge of & hands on experience in advanced, prevailing and emerging silicon, package & substrate technologies, bumping and assembly processes, design rules, failure analysis tools and techniques, materials and equipment, applicable industry standards, regulations & quality systems.

–Good team player with project management, analytical, problem-solving and interpersonal skills. Must be self-driven, flexible and agile, result oriented individual. Ability to develop concepts into structured projects, generate new and innovative solutions to complex problems and handle multiple programs concurrently.

–Hands-on experience of use of modelling (Thermal & Mechanical) & Sub / PCB Design CAD tools (APD, AutoCAD, Solidworks etc) for design optimization.

–Sound knowledge of advanced node silicon fabrication, PCB technologies and board assembly processes, applicable industry standards, quality systems and regulations.

–Communicate extensively with internal and external team members, customers in various global locations and may require travel from time to time.

Compensation and Benefits

The annual base salary range for this position is To

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Welcome! Thank you for your interest in Broadcom!

We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.

For more information please visit our video library (http://www.broadcom.com/videos) and check out our Connected by Broadcom (https://www.broadcom.com/support/resources/video-webinar-library?channel=5c9658f7c1d34eca91c6cc16178e5b1b&video=7d72b04ea50046a394e682fab640ce20) series.

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