Wafer-Level Packaging Process Engineer – Advanced Tech

Micron

Singapore

On-site

SGD 120,000 - 180,000

Full time

11 days ago

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Job summary

Micron Technology, Inc. is seeking a packaging/process engineer to drive next-generation advanced packaging for memory products.

You will lead process development, integration, and qualification across hybrid bonding, thermo-compression bonding, flip chip, and emerging packaging tech. You will collaborate with Process Integration, Materials, Equipment, Reliability, Design, Manufacturing, and Quality to deliver robust production-ready solutions and accelerate technology readiness for the

Qualifications

PhD with ≥3 years or Master's with ≥5 years or Bachelor's with ≥7 years in a relevant field.
Semiconductor process development, assembly, advanced packaging or wafer processing experience.
Strong data analytics and programming skills for process modeling and analysis.
Experience with advanced packaging technologies and cross-functional collaboration.

Responsibilities

Process Development: establish and improve wafer-level processes; reduce costs; meet node requirements.
Equipment and Materials: evaluate new equipment/materials; set up process parameters.
Quality Improvement: ensure defense coverage; identify improvement opportunities; analyze data.
Collaboration: work with internal/external partners; support transfer to high-volume manufacturing.
AI Responsibilities: apply AI tools to improve efficiency, quality, and problem solving.