Process Engineer: Advanced Wafer-Level Packaging

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking an engineer to develop and enable next-generation advanced packaging technologies, including hybrid bonding and thermo-compression bonding, and to drive technology readiness for manufacturing transfer.

The role collaborates with Process Integration, Materials, Equipment, Reliability, Design, Manufacturing, and Quality teams to accelerate innovation and optimize yield and reliability in high-volume production.

Qualifications

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC, and RMS for equipment and process control.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.

Responsibilities

• Process Development: Establish and improve wafer level process conditions and technologies (wafer thinning, backside metal interconnect).
• Upgrade process capabilities and reduce production costs.
• Establish and improve process management projects to deliver technology node requirements and scaling for next node.
• Quality Improvement: Ensure defense coverage through process, measurement, inspection, and testing.
• Establish correlations between defense mechanisms to identify improvement opportunities.
• AI Responsibilities: Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness.

Skills

Python

R

SQL

Education

PhD with ≥3 years or Master’s with ≥5 years or Bachelor’s with ≥7 years in EE/Materials/Chemical/Physics

Tools

Visual Basic for automation

Job description

Micron Technology, Inc. in Singapore is seeking an engineer to develop and enable next-generation advanced packaging technologies, including hybrid bonding and thermo-compression bonding, and to drive technology readiness for manufacturing transfer.

The role collaborates with Process Integration, Materials, Equipment, Reliability, Design, Manufacturing, and Quality teams to accelerate innovation and optimize yield and reliability in high-volume production.