Principal/Senior Advanced Packaging Development Process Engineer

Micron Technology, Inc; Singapore; On-site; SGD 120,000 - 160,000; Full time

Benefits offered by this job

Medical plans

Dental plans

Vision plans

Paid time off

Paid holidays

Benefits guidance

Job summary

Micron Technology, Inc in Singapore seeks a Principal/Senior Advanced Packaging Development Process Engineer to lead next-generation packaging initiatives. You will drive concept to qualification and transfer, collaborating with Process Integration, Materials, Equipment, Reliability, Design, Manufacturing and Quality teams to accelerate readiness for production.

The role emphasizes process development, DOE execution, data-driven decision making, and AI-enabled analytics to enhance yield and

Qualifications

• Master's degree or higher in Materials Science, Chemical/Mechanical/Electrical Engineering, Physics or related field.
• 3+ years in semiconductor process development, integration or advanced packaging.
• Hands-on in Hybrid Bonding, TCB, Flip Chip or related packaging tech.
• Strong analytical, statistical, and problem-solving skills; English communication.

Responsibilities

• Develop and qualify next-generation advanced packaging and assembly technologies.
• Design, execute, and analyze DOE to optimize performance, yield and manufacturability.
• Lead process development, setup, characterization, defect reduction and transfer.
• Perform data analysis and root-cause investigations with statistics and engineering methods.
• Collaborate cross-functional teams to ensure technology development and high-volume readiness.
• Evaluate new materials, equipment, and process tech for future product needs.
• Drive troubleshooting, yield improvement, and defect reduction through systematic methods.
• Maintain process documentation, qualification reports, and transfer packages.
• Monitor process health using SPC, FDC and reliability data.
• Apply AI, automation, and analytics to improve development efficiency and decisions.

Skills

Hybrid Bonding

Thermo-Compression Bonding

Flip Chip

Advanced Packaging

DOE

Statistical Analysis

Process Development

Cross-functional Collaboration

English Fluency

Education

Master's degree or higher

Tools

DOE tools

Statistical methods

Metrology tools

Job description

Req. ID: JR106718 Principal/Senior Advanced Packaging Development Process Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Job Description

Playing a key role in developing and enabling next-generation advanced packaging technologies for future memory and semiconductor products. This position is responsible for process development, characterization, integration, and qualification of advanced assembly solutions, including hybrid bonding, thermo-compression bonding (TCB), flip chip, and emerging packaging technologies.

The engineer will lead technology development activities from concept through qualification and manufacturing transfer, working closely with cross-functional teams including Process Integration, Materials, Equipment, Reliability, Design, Manufacturing, and Quality organizations. The successful candidate will drive technical innovation, solve complex process challenges, and accelerate technology readiness to support Micron’s advanced packaging roadmap.

Key Responsibilities

• Develop and qualify next-generation advanced packaging and assembly technologies, including Hybrid Bonding, Thermo-Compression Bonding (TCB), Flip Chip, and other emerging packaging solutions.
• Design, execute, and analyze DOE (Design of Experiments) to optimize process performance, yield, reliability, and manufacturability.
• Lead process development activities, including process setup, characterization, defect reduction, and process window optimization.
• Perform technical data analysis and drive root-cause investigations using statistical methods and engineering principles.
• Collaborate with cross-functional teams to ensure successful technology development, process integration, and high-volume manufacturing readiness.
• Evaluate and introduce new materials, equipment, and process technologies to enable future product requirements.
• Drive process troubleshooting, yield improvement, and defect reduction through systematic problem-solving methodologies.
• Develop and maintain process documentation, qualification reports, specifications, and manufacturing transfer packages.
• Monitor process health using SPC, FDC, metrology, and reliability data to ensure process stability and capability.
• Support customer sample builds, engineering evaluations, and technology milestone deliverables.
• Apply AI, automation, and advanced analytics tools to improve process development efficiency, failure analysis, and technical decision-making.
• Lead or participate in strategic technology initiatives, supplier engagements, and cross-site development programs.

Required Qualifications

• Master's degree or higher in Materials Science, Chemical Engineering, Mechanical Engineering, Physics, Chemistry, Electrical Engineering, or a related field.
• Minimum 3 years of experience in semiconductor process development, process integration, advanced packaging, or assembly technology.
• Hands-on experience in one or more of the following areas:
  • Hybrid Bonding (C2W, W2W, D2D)
  • Thermo-Compression Bonding (TCB)
  • Flip Chip Assembly
  • Advanced Packaging Process Development
• Strong analytical, statistical, and technical problem-solving skills.
• Experience with DOE methodologies, data analysis, and process characterization.
• Demonstrated ability to independently manage complex technical projects in a fast-paced development environment.
• Fluency in written and verbal communication skills in English.
• Proven ability to collaborate effectively across global and cross-functional teams.

Preferred Qualifications

• Experience in HBM, 2.5D/3D Packaging, Chiplet Integration, or Advanced Memory Packaging technologies.
• Knowledge of package reliability, failure analysis, material characterization, and statistical process control.
• Experience with semiconductor manufacturing systems, SPC/FDC methodologies, and advanced metrology tools.
• Familiarity with artificial intelligence, machine learning, automation, or data analytics applications for semiconductor process development.
• Experience transferring technologies from R&D development environments to high-volume manufacturing.
• Experience working with external equipment and material suppliers to evaluate and qualify new technologies.
• Leverage artificial intelligence in day-day task & innovate within projects/tasks.

Key Success Factors

• Passion for technology innovation and continuous improvement.
• Strong ownership mindset with the ability to drive results independently.
• Ability to manage multiple priorities while maintaining high technical rigor.
• Effective collaboration and communication across global teams and organizations.
• Commitment to delivering breakthrough packaging solutions that enable future semiconductor products.

Job Profile(s):

Product Development Engineer 5

Relocation level: (TBD)

• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.
• For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.