Process Engineer, Next-Gen Wafer-Level Packaging

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. seeks a senior engineer to lead process development and qualification of next-generation packaging technologies such as wafer-level and hybrid bonding.

The role involves coordinating with Process Integration, Materials, Equipment, Reliability, Design, Manufacturing, and Quality to accelerate technology readiness. The candidate will drive innovation, optimize processes, and enable smooth product transfers to high-volume manufacturing, using

Qualifications

• PhD with≥3 years or Master’s degree with ≥5 years, or Bachelor’s degree with ≥7 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.
• Demonstrated expertise in semiconductor process development, assembly, advanced packaging, or wafer processing.
• Willingness to apply AI-enabled tools and data-driven methods to optimize manufacturing processes.

Responsibilities

• Lead process development activities from concept through qualification and transfer to manufacturing.
• Collaborate with Package Integration, Assembly Engineering, Front End Wafer Fab, and Global Quality to integrate manufacturing processes.
• Drive technology readiness and cost reductions through process improvements and new equipment/material evaluations.
• Ensure documentation (POR/MOR) for product transfer to high-volume manufacturing facilities.
• Integrate AI-assisted tools to improve efficiency and quality in daily work.

Skills

Python

R

SQL

Data analytics

DOE

Dashboarding

Process modeling

Analytical thinking

Education

PhD with ≥3 years, or Master’s ≥5, or Bachelor’s ≥7 in Electrical Engineering / Materials Science / Chemical Engineering / Physics or related field

Tools

Visual Basic for automation

E3

FDC

RMS

Job description

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. seeks a senior engineer to lead process development and qualification of next-generation packaging technologies such as wafer-level and hybrid bonding.

The role involves coordinating with Process Integration, Materials, Equipment, Reliability, Design, Manufacturing, and Quality to accelerate technology readiness. The candidate will drive innovation, optimize processes, and enable smooth product transfers to high-volume manufacturing, using