Senior Advanced Packaging Process Engineer

Micron; Singapore; On-site; SGD 180,000 - 260,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks a Principal - Staff Advanced Packaging Development Process Engineer to lead wafer singulation technology development for next-generation HBM and packaging products. You will drive dicing, thinning, and die separation with cross-functional teams and suppliers.

You will apply DOE, SPC, JMP, and data analysis to improve yield and process capability while guiding technology transfer to production and AI-driven efficiency improvements.

Qualifications

• PhD with ≥3 years, or Master's with ≥5 years, or Bachelor's with ≥7 years in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
• Demonstrated expertise in semiconductor process development, assembly, advanced packaging, or wafer processing.
• Hands-on experience in wafer dicing, die separation, wafer thinning/grinding, or advanced packaging technologies.
• Strong knowledge of DOE, SPC, JMP, and data analysis.

Responsibilities

• Develop and optimize advanced wafer singulation technologies (blade dicing, laser grooving, stealth dicing, laser full-cut, plasma dicing, die separation).
• Support wafer thinning, grinding, mounting, and handling for advanced packaging applications.
• Design and execute DOE plans to improve yield, quality, and process capability.
• Evaluate and qualify new dicing equipment, tooling, and materials.
• Conduct process characterization, defect analysis, and root-cause investigations using statistical methods.
• Drive yield improvement and process troubleshooting using KT, 5-Why, and 8D methodologies.
• Collaborate with Process Integration, Reliability, Equipment, and Manufacturing teams to enable technology development and transfer to production.
• Monitor process health using SPC, FDC, JMP, and data analytics tools.
• Partner with external suppliers to co-develop equipment and materials for future technology nodes.

Skills

Wafer dicing

Die separation

Wafer thinning/grinding

Advanced packaging technologies

DOE

SPC

JMP

Data analysis

Problem solving

Education

PhD in Electrical Engineering

Master's in Electrical Engineering

Bachelor's in Electrical Engineering

Tools

JMP

SPC

Job description

Micron Technology, Inc. in Singapore seeks a Principal - Staff Advanced Packaging Development Process Engineer to lead wafer singulation technology development for next-generation HBM and packaging products. You will drive dicing, thinning, and die separation with cross-functional teams and suppliers.

You will apply DOE, SPC, JMP, and data analysis to improve yield and process capability while guiding technology transfer to production and AI-driven efficiency improvements.