Advanced Packaging Process Engineer: Hybrid Bonding & TCB Expert

Micron Technology; Singapore; On-site; SGD 115,000 - 192,000; Full time

Job summary

Micron Technology, Inc. is seeking an engineer to advance next-generation packaging technologies, including Hybrid Bonding, Thermo-Compression Bonding, and Flip Chip.

You will run DOE studies, lead process development, and enable seamless transfer to manufacturing with cross-functional teams across Process Integration, Materials, Equipment, Reliability, Design, Manufacturing, and Quality. The role requires a Master's degree and 3+ years in semiconductor process development or advanced packaging,

Qualifications

• Master's degree or higher in a related field.
• Minimum 3 years of experience in semiconductor process development, process integration, advanced packaging, or assembly technology.
• Hands-on experience in Hybrid Bonding, Thermo-Compression Bonding, Flip Chip, or Advanced Packaging.

Responsibilities

• Develop and qualify next-generation advanced packaging and assembly technologies including Hybrid Bonding, TCB, Flip Chip, and others.
• Design, execute, and analyze DOE to optimize process performance, yield, reliability, and manufacturability.
• Lead process development activities including setup, characterization, defect reduction, and process window optimization.
• Perform technical data analysis and drive root-cause investigations using statistical methods.
• Collaborate with cross-functional teams to ensure successful technology development and high-volume manufacturing readiness.
• Evaluate and introduce new materials, equipment, and process technologies to enable future product needs.
• Drive process troubleshooting, yield improvement, and defect reduction through systematic problem-solving.
• Develop and maintain process documentation, qualification reports, specs, and transfer packages.
• Monitor process health using SPC, FDC, metrology, and reliability data for stability and capability.
• Support customer sample builds, engineering evaluations, and technology milestones.
• Apply AI, automation, and advanced analytics to improve development efficiency and technical decisions.
• Lead or participate in strategic technology initiatives and supplier engagements.

Skills

Analytical skills

Statistical skills

Technical problem-solving

Education

Master's degree or higher in related field

Tools

Advanced metrology tools

Semiconductor manufacturing systems

SPC/FDC methodologies

AI/ML/Automation

Job description

Micron Technology, Inc. is seeking an engineer to advance next-generation packaging technologies, including Hybrid Bonding, Thermo-Compression Bonding, and Flip Chip.

You will run DOE studies, lead process development, and enable seamless transfer to manufacturing with cross-functional teams across Process Integration, Materials, Equipment, Reliability, Design, Manufacturing, and Quality. The role requires a Master's degree and 3+ years in semiconductor process development or advanced packaging,