Principal/Staff/Senior Engineer - Advanced Packaging & Wafer Tech

Micron Technology, Inc; Singapore; On-site; SGD 110,000 - 170,000; Full time

Benefits offered by this job

No perks listed

Job summary

Micron Technology, Inc. is seeking a Principal/Staff/Senior Engineer within APTD CEM – Advanced Packaging Wafer Level Technology Engineering.

You will develop and deploy wafer finishing processes, optimize capabilities, and collaborate with cross‑functional teams to ensure smooth tech transfers from development to high‑volume production. The role requires strong data analytics, experience in semiconductor processing, and proficiency in Python, R, SQL and automation tools.

Qualifications

• B.S./M.S./Ph.D. in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related fields.
• 2+ years of semiconductor process development experience, preferably in wafer bonding, plating, warpage control, and packaging.
• Proficiency in Python, R, SQL for statistics, process modeling, and data analytics.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC, and RMS for equipment and process control.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.

Responsibilities

• Develop and enable deployment of processes related to post‑fab wafer finishing (wafer thinning, backside metal interconnect).
• Upgrade process capabilities and reduce production costs.
• Establish and improve process management projects to deliver technology node requirements and scaling for the next node.
• Evaluate and promote new equipment and materials to enhance process capabilities.
• Set up process parameters for various semiconductor equipment.
• Ensure defense coverage through process, measurement, inspection, and testing.

Skills

Python

R

SQL

Visual Basic for automation

Data analytics

Education

B.S./M.S./Ph.D. in Chemical Engineering / Electrical Engineering / Mechanical Engineering / Physics

Tools

E3

FDC

RMS

Job description

Micron Technology, Inc. is seeking a Principal/Staff/Senior Engineer within APTD CEM – Advanced Packaging Wafer Level Technology Engineering.

You will develop and deploy wafer finishing processes, optimize capabilities, and collaborate with cross‑functional teams to ensure smooth tech transfers from development to high‑volume production. The role requires strong data analytics, experience in semiconductor processing, and proficiency in Python, R, SQL and automation tools.