Principal Advanced Packaging Engineer - Process Innovation

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD

Singapore

On-site

SGD 120,000 - 180,000

Full time

10 days ago

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Job summary

Micron Technology Asia Operations Pte Ltd in Singapore is seeking a Process Development Engineer focused on next-generation advanced packaging technologies, including hybrid bonding, thermo-compression bonding (TCB), flip chip, and emerging packaging technologies.

The engineer will lead technology development activities from concept through qualification and manufacturing transfer, working closely with cross-functional teams including Process Integration, Materials, Equipment, Reliability,

Qualifications

> PhD with ≥3 years or Master’s with ≥5 years, or Bachelor’s with ≥7 years in Electrical Engineering, Materials Science, Chemical Engineering, Physics or related field.
> Demonstrated expertise in semiconductor process development, assembly, advanced packaging, or wafer processing.
> Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
> Experience with Visual Basic for automation and tool integration.
> Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
> Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
> Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability
> Strong analytical and problem-solving capabilities.
> Outstanding communication, leadership, and stakeholder management skills.
> Ability to work independently and collaboratively in a fast-paced environment.
> Ability to work cross-functionally with process, equipment, and reliability teams.
> AI literacy to use AI-enabled tools responsibly and effectively.

Responsibilities

Establish and optimize wafer-level process conditions and technologies (wafer thinning, backside metal interconnect).
Upgrade process capabilities and reduce production costs.
Manage projects to deliver technology node requirements and scaling for next node.
Evaluate and promote new equipment and materials to enhance process capabilities.
Set up process parameters for semiconductor equipment.
Evaluate, promote, and plan for new equipment and materials.
Ensure defense coverage through process, measurement, inspection, and testing.
Establish correlations between defense mechanisms to identify improvement opportunities.
Conduct continuous data analysis to establish advanced controls and improvements.
Collaborate with internal/external partners to build and execute technology development strategies.
Work with Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality to integrate processes for optimal performance and quality control.
Ensure smooth transition from new product development, qualification, small volume production to high volume production.
Provide POR and MOR documentation for product transfer to production facilities.
Integrate AI-assisted tools in daily work to improve efficiency, quality, or effectiveness.