Senior Advanced Packaging Innovation Engineer

Micron Technology, Inc; Singapore; On-site; SGD 120,000 - 170,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks a Principal/Senior Advanced Packaging Development Process Engineer to lead development of next-generation packaging technologies such as Hybrid Bonding, TCB, and Flip Chip.

You will collaborate with Process Integration, Materials, Equipment, Reliability, Design, Manufacturing, and Quality teams. The role emphasizes DOE design, data-driven problem solving, cross-site collaboration, and advancing manufacturing transfer to high-volume production while

Qualifications

• Master's degree or higher in Materials Science, Chemical Engineering, Mechanical Engineering, Physics, Chemistry, Electrical Engineering, or a related field.
• Minimum 3 years of experience in semiconductor process development, integration, or advanced packaging.
• Hands-on experience with Hybrid Bonding, Thermo-Compression Bonding (TCB), Flip Chip, or advanced packaging processes.
• Strong analytical, statistical, and problem-solving skills; proficient with DOE methodologies.
• Experience collaborating across global cross-functional teams and strong English communication.
• Ability to manage complex projects in fast-paced development environments.

Responsibilities

• Develop and qualify next-generation advanced packaging technologies including Hybrid Bonding, TCB, Flip Chip, and other emerging solutions.
• Design, execute, and analyze DOE to optimize process performance, yield, reliability, and manufacturability.
• Lead process development activities including process setup, characterization, defect reduction, and process window optimization.
• Perform technical data analysis and drive root-cause investigations using statistical methods and engineering principles.
• Collaborate with cross-functional teams to ensure successful technology development, process integration, and high-volume manufacturing readiness.
• Apply AI, automation, and advanced analytics tools to improve process development efficiency, failure analysis, and technical decision-making.

Skills

Analytical skills

Statistical analysis

Problem-solving

English communication

Education

Master's degree or higher in Materials Science, Chemical Engineering, Mechanical Engineering, Physics, Chemistry, Electrical Engineering

Tools

DOE tools

Metrology tools

Job description

Micron Technology, Inc. in Singapore seeks a Principal/Senior Advanced Packaging Development Process Engineer to lead development of next-generation packaging technologies such as Hybrid Bonding, TCB, and Flip Chip.

You will collaborate with Process Integration, Materials, Equipment, Reliability, Design, Manufacturing, and Quality teams. The role emphasizes DOE design, data-driven problem solving, cross-site collaboration, and advancing manufacturing transfer to high-volume production while