Innovative Wafer-Level Packaging Process Engineer

Micron Technology; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Micron Technology in Singapore seeks a seasoned Process Development Engineer to lead development and qualification of next-generation packaging technologies, including hybrid bonding, thermo-compression bonding, flip chip, and emerging packaging solutions.

You will drive technology transfer, work with Process Integration, Materials, Equipment, Reliability, Design, Manufacturing, and Quality teams to align with Micron’s packaging roadmap.

Qualifications

• PhD with ≥3 years or Master’s degree with ≥5 years, or Bachelor’s degree with ≥7 years in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.
• Demonstrated expertise in semiconductor process development, assembly, advanced packaging, or wafer processing.

Responsibilities

• Establish and improve wafer level process conditions and technologies (wafer thinning, backside metal interconnect).
• Upgrade process capabilities and reduce production costs.
• Establish and improve process management projects to deliver technology node requirements and scaling for next node.
• Evaluate and promote new equipment and materials to enhance process capabilities.
• Set up process parameters for a variety of semiconductor equipment.
• Evaluate, promote, and plan for new equipment and materials.
• Ensure defense coverage through process, measurement, inspection, and testing.
• Ensure correlations between defense mechanisms to identify improvement opportunities.
• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities.
• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives.
• Work closely with various teams to integrate manufacturing processes for optimal performance and quality control.
• Ensure smooth transition from new product development, qualification, small volume production to high volume production.
• Provide POR and MOR documentation for product transfer to production High Volume Manufacturing facilities.
• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness.
• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Skills

Python

R

SQL

DOE

Data analytics

Process modeling

Education

PhD with ≥3 years or Master’s degree with ≥5 years, or Bachelor’s degree with ≥7 years in Electrical Engineering, Materials Science, Chemical Engineering, Physics or related field

Tools

Visual Basic for automation

E3

FDC

RMS

Job description

Micron Technology in Singapore seeks a seasoned Process Development Engineer to lead development and qualification of next-generation packaging technologies, including hybrid bonding, thermo-compression bonding, flip chip, and emerging packaging solutions.

You will drive technology transfer, work with Process Integration, Materials, Equipment, Reliability, Design, Manufacturing, and Quality teams to align with Micron’s packaging roadmap.