Senior Tech Lead, HBM Product Systems & Test

1100 Micron SemiAsiaOP Pte Ltd

Singapore

On-site

SGD 120,000 - 180,000

Full time

14 days+
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Job summary

Micron Technology, Inc. in Singapore seeks an experienced engineering leader for the High Bandwidth Memory (HBM) Product Engineering Media Health team.

You will spearhead a high performing team responsible for Media Health manufacturing and validation of Micron’s next generation HBM products, working across DRAM, interface die, and stacked die products. You will drive test flow development, yield improvement, reliability, and cost reduction, mentor others, manage projects, and collaborate with

Qualifications

  • Bachelor/Master in Electrical and Electronics Engineering with 8+ years in semiconductors.
  • Strong leadership and technical problem-solving skills with deep circuit analysis.
  • Proficient in statistics, data analysis tools, and scripting.
  • Excellent communication and presentation abilities, collaborative across teams.

Responsibilities

  • Optimize test coverage for current and future HBM architectures and nodes.
  • Develop, validate, characterize, and qualify next-generation HBM products.
  • Support design verification and circuit modeling using CAD tools and Verilog simulations.
  • Improve manufacturing test yields and reduce test time, addressing device issues across DRAM, interface, and stacked die.
  • Lead cross-functional collaboration with Fab, Design, Technology Development, and Quality/Reliability teams.

Skills

Leadership
Problem solving
Data analysis
Scripting
Communication

Education

Bachelor's / Master’s in Electrical and Electronics Engineering

Tools

CAD tools
Verilog simulations

Job description

Micron Technology, Inc. in Singapore seeks an experienced engineering leader for the High Bandwidth Memory (HBM) Product Engineering Media Health team.

You will spearhead a high performing team responsible for Media Health manufacturing and validation of Micron’s next generation HBM products, working across DRAM, interface die, and stacked die products. You will drive test flow development, yield improvement, reliability, and cost reduction, mentor others, manage projects, and collaborate with

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