HBM Product Engineering Lead — Senior Manager

Micron Technology, Inc; Singapore; On-site; SGD 180,000 - 240,000; Full time

Benefits offered by this job

Medical plans

Dental plans

Vision plans

Paid time off

Relocation assistance

Job summary

Micron Technology, Inc. seeks an experienced Senior Manager for HIG HBM Product System Engineering (Media Health Manufacturing) in Singapore. Lead a high-performing team driving Media Health Manufacturing for Micron’s latest HBM products, visibles across DRAM and Interface die and stacked product.

You will optimize test coverage, develop validation plans, and drive cost, cycle time and quality improvements while collaborating with cross-functional teams globally.

Qualifications

• Bachelors/Masters in Electrical and Electronics Engineering with 10+ years in semiconductors.
• Strong leadership and problem-solving skills with root cause analysis.
• Proficient in statistics, data analysis tools, and scripting.
• Willingness to work on site in Singapore with international travel.

Responsibilities

• Optimize test coverage on all current and future HIG HBM design architectures and process nodes.
• Develop, validate, characterize, and qualify Micron’s next-generation HBM products.
• Support design validation and in-depth circuit analysis using CAD tools and Verilog simulations.
• Improve manufacturing test yields and reduce test time.
• Lead cross-functional collaboration across Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams.
• Mentor team members and drive innovation and project management.

Skills

Leadership

Root cause analysis

Data analysis

Scripting

Communication

Education

Bachelors/Masters in Electrical and Electronics Engineering

Tools

CAD tools

Verilog simulations

Job description

Micron Technology, Inc. seeks an experienced Senior Manager for HIG HBM Product System Engineering (Media Health Manufacturing) in Singapore. Lead a high-performing team driving Media Health Manufacturing for Micron’s latest HBM products, visibles across DRAM and Interface die and stacked product.

You will optimize test coverage, develop validation plans, and drive cost, cycle time and quality improvements while collaborating with cross-functional teams globally.