HBM Product Engineering Lead - Principal Engineer

Micron Technology

Singapore

On-site

SGD 150,000 - 190,000

Full time

3 days ago
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Job summary

Micron Technology Singapore seeks a senior engineer to lead the High Bandwidth Memory (HBM) Product Engineering Media Health team. You will spearhead a high performing group, drive test coverage, product development, validation, and cross-functional collaboration across Fab, Design, and Quality teams to ship next-generation HBM products.

The role focuses on optimizing yield, cost, cycle time, and reliability, with on-site work in Singapore and international travel to the US, Taiwan, and Japan.

Qualifications

  • Bachelor's or master's degree in Electrical and Electronics Engineering.
  • 8+ years of experience in the semiconductor industry.
  • Strong leadership and problem solving with in-depth circuit analysis.
  • Experience with statistics, data analysis tools, and scripting.

Responsibilities

  • Optimized test coverage for current and future HBM architectures.
  • Lead development, validation, and characterization of next-gen HBM products.
  • Provide design verification support using CAD tools and Verilog simulations.
  • Improve yield and reduce costs by optimizing manufacturing test flow.
  • Mentor team members and drive cross-functional collaboration.
  • Make technical decisions on risk, prioritization, and project direction.
  • Collaborate with Fab, HBM Tech Development, Design, System Dev and QA/Reliability.

Skills

Leadership
Test coverage
Product engineering
CAD tools
Verilog simulations
Data analysis
Scripting

Education

Bachelors/Masters Electrical and Electronics Engineering

Tools

CAD tools
Verilog
Python scripting
EDA tools

Job description

Micron Technology Singapore seeks a senior engineer to lead the High Bandwidth Memory (HBM) Product Engineering Media Health team. You will spearhead a high performing group, drive test coverage, product development, validation, and cross-functional collaboration across Fab, Design, and Quality teams to ship next-generation HBM products.

The role focuses on optimizing yield, cost, cycle time, and reliability, with on-site work in Singapore and international travel to the US, Taiwan, and Japan.

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