HBM Product Engineer - Test & Yield Innovator

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. is seeking an experienced engineer for the High Bandwidth Memory (HBM) Product Engineering - Media Health team in Singapore. You will drive manufacturing test flow development, yield improvements, and test strategy optimization for next-generation HBM products, including DRAM and stacked die solutions.

Collaborate with Fab, Design, and Quality teams to advance technology leadership. The role emphasizes ownership of KPIs (Quality, Cost, Cycle Time, Scale), test coverage,

Qualifications

• Bachelor’s or Master’s in Electrical/Electronics Engineering or related field.
• Experience in semiconductor devices, circuit design, or product validation.
• Understanding of CMOS technology, DRAM architecture, and device physics.

Responsibilities

• Optimize test coverage for current and future HBM architectures and process nodes.
• Develop, validate, characterize, and qualify Micron's next-gen HBM products.
• Support design verification and in-depth circuit work using CAD tools and Verilog simulations.
• Improve manufacturing test yields, reduce test time, and resolve yield-related issues.
• Drive cost reduction, cycle-time improvements, and process optimization.
• Mentor and develop team members; manage cross-functional projects.
• Make technical risk decisions and prioritize projects.
• Collaborate with Fab, HBM teams, System Development, and Quality/Reliability.
• Leverage AI-powered tools to boost productivity and efficiency.

Skills

Semiconductor devices

Circuit design

Product validation

Root cause analysis

Data analysis

Python scripting

Verilog simulations

Team collaboration

English communication

Education

Electrical/Electronics Engineering degree

Tools

Verilog

CAD tools

Python

JMP

Job description

Micron Technology, Inc. is seeking an experienced engineer for the High Bandwidth Memory (HBM) Product Engineering - Media Health team in Singapore. You will drive manufacturing test flow development, yield improvements, and test strategy optimization for next-generation HBM products, including DRAM and stacked die solutions.

Collaborate with Fab, Design, and Quality teams to advance technology leadership. The role emphasizes ownership of KPIs (Quality, Cost, Cycle Time, Scale), test coverage,