Senior Scientist/ Principal Scientist (HI), IME

Agency for Science, Technology and Research (A*STAR); Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

A leading research organization in Singapore is looking for a passionate Scientist or Senior Scientist to advance chip-to-wafer bonding and contribute to innovative technologies in semiconductor packaging. The role requires a PhD and 5 to 10 years of relevant experience. Responsibilities include leading projects, conducting research, and collaborating with various stakeholders to develop advanced integration processes for AI and high-performance computing applications. This position offers the opportunity to make significant contributions to cutting-edge research.

Qualifications

• PhD in Materials Science and Engineering, Mechanical or Chemical Engineering, or related field.
• 5 to 10 years of experience in device fabrication and advanced packaging processes.
• Hands-on experience in BEOL wiring processes and hybrid bonding.

Responsibilities

• Lead internal capability development involving new materials and advanced process integration.
• Manage multi-disciplinary project teams and mentor junior colleagues.
• Conduct research into advanced bonding techniques, enhancing process capabilities.

Skills

Device fabrication

Problem-solving skills

Data analysis

Communication abilities

Education

PhD in Materials Science or related field

Tools

Hybrid bonding equipment

Job description

JOB DESCRIPTION

Advanced Packaging Program at the Institute of Microelectronics (IME) is seeking a passionate and skilled Scientist or Senior Scientist to join our team. The candidate will be responsible to advance the state-of-the-art chip-to-wafer and wafer-to-wafer fusion/hybrid bonding capabilities, develop 2.5D interposer and 3D chip stacking process integration flows for Heterogenous Integration of chiplets for Artificial Intelligence and High-Performance Computing applications, and conducting electrical, thermal and mechanical reliability characterization. The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.

Key Responsibilities

• Conceptualise and lead internal capability development and external industry projects involving new materials, advanced process integration approaches, and innovative concepts.
• Lead multi-disciplinary project team for the execution of industry projects with manageable risks and mentor less experienced colleagues.
• Engage and manage internal and external stakeholders for the R&D projects execution and provide timely updates for timely deliverable.
• Conduct research and develop advanced fine-pitch flip-chip & hybrid bonding techniques for chip-to-wafer, emphasizing bonding parameter optimization and process enhancements.
• Investigate and refine wafer bonding processes for interposer fabrication, inter-dielectric gap fill, and alignment accuracy, addressing critical factors such as warpage, bonding strength, and yield.
• Optimize die-bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, bonding materials and bonding methods.
• Conduct engineering experiments for process characterization to drive quality and yield improvements.
• Act as a subject matter expert (SME) for both internal and external stakeholders, providing guidance and expertise.
• Collaborate with senior staff, process integrators, and external partners to address technology roadmap and process capabilities development.
• Inspire and mentor talents in semiconductor technology, contributing to workforce development in the field.

JOB REQUIREMENT/Qualifications

• PhD in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
• 5 to 10 years of experience in device fabrication, back-end-of-line (BEOL) and advanced packaging processes & integration required for 2.5D/3D heterogeneous integration applications. Project and stakeholder (including industry partners) management experience will be added advantage. Hands-on experience in BEOL wiring processes & integration, C2W/W2W fusion/hybrid bonding and flip-chip bonding are required.
• Strong knowledge in advanced packaging technologies in particular hybrid bonding equipment, bonding materials, processes & integration, andreliability characterization are preferable.
• Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments. Proven ability to troubleshoot and resolve process-related challenges. Excellent written and verbal communication abilities.
• Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.