Senior Packaging Process Engineer: Advanced Wafer Dicing

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Singapore

On-site

SGD 120,000 - 180,000

Full time

10 days ago

Get more replies from employers

Send a job-specific resume in minutes.

Job summary

Micron Semiconductor Asia Operations PTE. LTD. in Singapore seeks an Advanced Packaging Development Process Engineer to lead wafer singulation technology development for next-generation HBM and packaging products.

You will collaborate with cross-functional teams, equipment suppliers, and material partners to enable tech development and manufacturing readiness. Responsibilities include optimizing wafer dicing methods, wafer thinning, and die separation; designing DOE plans to improve yield and

Qualifications

Requires advanced degree in a relevant engineering/science field with several years of process development experience.
Experience in semiconductor packaging and wafer processing technologies is essential.

Responsibilities

Develop and optimize wafer dicing and die separation technologies.
Support wafer thinning, grinding, mounting for advanced packaging.
Design and execute DOE plans to improve yield and quality.
Evaluate and qualify new dicing equipment, tooling, and materials.
Conduct process characterization, defect analysis, and root-cause investigations.
Drive yield improvement and troubleshooting using structured methods (KT, 5-Why, 8D).
Collaborate with cross-functional teams to enable technology development and transfer to production.
Monitor process health using SPC, FDC, JMP and data analytics tools.
Partner with external suppliers to co-develop equipment and materials for future technology nodes.
Integrate AI-enabled tools and insights into daily work to improve efficiency and quality.
Identify and share AI-enabled enhancements within scope of work.