Senior Equipment Engineer, Wafer Packaging & Innovation

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd in Singapore is seeking an experienced engineer to develop and optimize advanced packaging equipment. The ideal candidate will have a strong background in semiconductor processes and equipment engineering.

Your responsibilities include improving equipment capability, evaluating new equipment, and leading the equipment team for seamless production transitions. We are looking for someone with strong analytical skills and a commitment to innovation.

Qualifications

• 5+ years of semiconductor process or equipment engineering experience.
• Proficiency in Python, R, SQL for statistical analysis.
• Experience in wafer bonding, plating, and packaging process development.

Responsibilities

• Develop and optimize packaging equipment for technology enablement.
• Focus on improving equipment capability and productivity.
• Lead the equipment team for optimal performance and quality control.

Skills

Python

R

SQL

Data analytics

Visual Basic

Education

B.S., M.S., or Ph.D. in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or Physics

Tools

E3

FDC (Fault Detection and Classification)

RMS (Recipe Management System)

Job description

1100 Micron SemiAsiaOP Pte Ltd in Singapore is seeking an experienced engineer to develop and optimize advanced packaging equipment. The ideal candidate will have a strong background in semiconductor processes and equipment engineering.

Your responsibilities include improving equipment capability, evaluating new equipment, and leading the equipment team for seamless production transitions. We are looking for someone with strong analytical skills and a commitment to innovation.