Senior Equipment Dev Engineer - Wafer Bonding & Packaging

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 120,000 - 190,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks an experienced equipment engineering professional to develop and optimize wafer-level packaging and stacking equipment.

You will drive process improvements, cost reductions, and productivity gains while coordinating with multiple internal teams and suppliers. The role requires 5+ years in semiconductor equipment, strong data analytics, and familiarity with MES/E3/FDC/RMS systems.

Qualifications

• B.S./M.S./Ph.D. in related technical fields such as Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or closely related areas.
• 5+ years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field stacking process equipment TC bonder/Hybrid Bonder.
• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC, and RMS for equipment and process control.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.

Responsibilities

• Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking.
• Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity.
• Establish and improve equipment management projects to deliver tech node requirements.
• Evaluate and promote new equipment and materials to enhance process capabilities.
• Establish hardware strategic roadmaps for 5+ years in post probe wafer and die processing.
• Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron's products.
• Ensure defense coverage through process, measurement, inspection, and testing.
• Establish correlations between defense mechanisms to identify improvement opportunities.
• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities with SMAI team.
• Collaborating with process development teams to develop innovative new solutions.
• Performing fundamental research to drive innovative solutions for next-generation equipment products.
• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives.
• Lead the equipment team to work closely with various teams to integrate manufacturing processes for optimal performance and quality control.
• Lead and ensure smooth transition from new product development, qualification, small volume production to high volume production.
• Constructs forecasts, proposals and strategic/tactical plans based on business data and market intelligence

Skills

Python

R

SQL

Visual Basic

Education

B.S./M.S./Ph.D. in related technical field

Tools

E3

FDC

RMS

Job description

Micron Technology, Inc. in Singapore seeks an experienced equipment engineering professional to develop and optimize wafer-level packaging and stacking equipment.

You will drive process improvements, cost reductions, and productivity gains while coordinating with multiple internal teams and suppliers. The role requires 5+ years in semiconductor equipment, strong data analytics, and familiarity with MES/E3/FDC/RMS systems.