Senior Packaging Engineer — AI-Driven 2.5D/3D Design Lead

AMD; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

AMD is seeking a seasoned Package Design Engineer in Singapore to drive end-to-end package design for complex products. You will lead substrate layouts, bump maps, and interposer designs, applying AI-driven techniques to improve productivity and quality.

The role requires strong ownership, ability to manage multiple projects, and collaboration with OSATs, foundries, and internal teams to meet performance, cost, and schedule targets.

Qualifications

• Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, or related field.
• Experience designing complex substrate designs such as Silicon Bridges or Interposers.
• Experience with advanced packaging technologies.
• Ability to thrive in fast-paced, high-pressure environments.

Responsibilities

• Lead end-to-end package design execution for complex products.
• Develop substrate layouts, bump maps, and interposer designs.
• Drive design decisions with SI/PI, mechanical, and SOC teams.

Skills

Package design

AI-driven design

Automation

Cross-functional collaboration

2.5D/3D packaging

Substrate design

Education

Bachelor’s or higher in Electrical Engineering / Computer Engineering

Tools

EDA tools

Job description

AMD is seeking a seasoned Package Design Engineer in Singapore to drive end-to-end package design for complex products. You will lead substrate layouts, bump maps, and interposer designs, applying AI-driven techniques to improve productivity and quality.

The role requires strong ownership, ability to manage multiple projects, and collaboration with OSATs, foundries, and internal teams to meet performance, cost, and schedule targets.