Senior Packaging Design Engineer (2.5D/3D) – AI-Driven

Advanced Micro Devices; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

Advanced Micro Devices is seeking a skilled SMTS Package Design Engineer in Singapore. This role involves leading complex package design execution while handling multiple projects in a fast-paced environment.

The ideal candidate will have at least 8 years of experience in substrate design and strong skills in AI/ML application. You will collaborate with engineering teams to drive innovations in packaging methodologies, incorporating advanced materials and design techniques.

Join AMD to push the boundaries of computing technology.

Qualifications

• Minimum 8+ years of experience in complex substrate design.
• Proven ability to execute in multi-project, fast-paced environments.
• Strong experience in 2.5D / 3D integration technologies.

Responsibilities

• Lead end-to-end package design execution for complex products.
• Drive design decisions collaborating with various engineering teams.
• Define and enhance package design methodologies and best practices.

Skills

Ownership and accountability

Collaboration and communication

AI/ML application

Fast-paced execution

Education

Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field

Tools

Cadence SIP / APD

Synopsys 3DICC or equivalent

Job description

Advanced Micro Devices is seeking a skilled SMTS Package Design Engineer in Singapore. This role involves leading complex package design execution while handling multiple projects in a fast-paced environment.

The ideal candidate will have at least 8 years of experience in substrate design and strong skills in AI/ML application. You will collaborate with engineering teams to drive innovations in packaging methodologies, incorporating advanced materials and design techniques.

Join AMD to push the boundaries of computing technology.