Senior Packaging Engineer - AI-Driven 2.5D/3D Design

AMD Ventures; Singapore; On-site; SGD 90,000 - 130,000; Full time

Benefits offered by this job

AMD benefits at a glance

Job summary

AMD in Singapore seeks a highly experienced Package Design Engineer to lead end-to-end package design for complex products. You will leverage AI-driven design techniques, automation, and next-generation workflows to address the increasing complexity of heterogeneous integration in cutting-edge packaging architectures.

The role requires hands-on substrate layouts, bump maps, and interposer designs (2.5D/3D, chiplet-based).

Qualifications

• Ownership and accountability across multiple programs.
• Proven ability to work in fast-phase, high-pressure environments.
• Apply AI/ML and automation to improve design productivity.
• Collaborate with cross-functional teams to drive design decisions.

Responsibilities

• Lead end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets.
• Handle multiple concurrent design programs in a fast-paced, high-pressure environment.
• Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures).
• Drive design decisions through close collaboration with SI/PI, mechanical, and SOC teams.
• Partner with internal engineering teams, OSATs, and substrate suppliers to deliver optimized solutions.
• Interface with stakeholders to communicate design status, risks, and mitigation strategies.
• Contribute to design reviews, signoff readiness, and tapeout processes.
• Define and enhance package design methodologies, flows, and best practices.
• Drive improvements in layout efficiency, reuse, and design standardization.
• Mentor junior engineers and promote engineering excellence across the team.

Skills

Ownership

Fast-paced delivery

AI in design

Independent work

Cross-functional collaboration

Education

Bachelor’s or higher in EE/CE

Tools

EDA tools

Job description

AMD in Singapore seeks a highly experienced Package Design Engineer to lead end-to-end package design for complex products. You will leverage AI-driven design techniques, automation, and next-generation workflows to address the increasing complexity of heterogeneous integration in cutting-edge packaging architectures.

The role requires hands-on substrate layouts, bump maps, and interposer designs (2.5D/3D, chiplet-based).