Senior Staff Packaging Engineer

Advanced Micro Devices; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

Advanced Micro Devices is seeking a skilled SMTS Package Design Engineer in Singapore. This role involves leading complex package design execution while handling multiple projects in a fast-paced environment.

The ideal candidate will have at least 8 years of experience in substrate design and strong skills in AI/ML application. You will collaborate with engineering teams to drive innovations in packaging methodologies, incorporating advanced materials and design techniques.

Join AMD to push the boundaries of computing technology.

Qualifications

• Minimum 8+ years of experience in complex substrate design.
• Proven ability to execute in multi-project, fast-paced environments.
• Strong experience in 2.5D / 3D integration technologies.

Responsibilities

• Lead end-to-end package design execution for complex products.
• Drive design decisions collaborating with various engineering teams.
• Define and enhance package design methodologies and best practices.

Skills

Ownership and accountability

Collaboration and communication

AI/ML application

Fast-paced execution

Education

Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field

Tools

Cadence SIP / APD

Synopsys 3DICC or equivalent

Job description

Overview

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary.

The Role

Help turn “possibility” into “reality” every day. At AMD, we push the boundaries of what is possible by delivering innovative, high-performance computing solutions across data center, AI, and advanced packaging technologies.

We are seeking a highly experienced SMTS Package Design Engineer to support complex package design execution. This role requires a self-driven technical expert who thrives in a fast-paced, dynamic, and high-pressure environment, and can deliver high-quality designs with speed, precision, and scalability.

The successful candidate will play a key role in advancing AMD’s packaging methodologies by leveraging AI-driven design techniques, automation, and next-generation workflows to address the increasing complexity of heterogeneous integration and advanced packaging architectures.

The Person

The ideal candidate is an experienced package or silicon physical designer who:

• Demonstrates strong ownership and accountability across multiple programs
• Excels in fast-phase execution environments with competing priorities
• Applies AI/ML and automation to improve design productivity and quality
• Operates with minimal supervision while influencing cross-functional teams
• Balances deep technical expertise with strong collaboration and communication skills

Key Responsibilities

Design Execution & Technical Leadership

• Lead end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets are met
• Handle multiple concurrent design programs in a fast-paced and high-pressure environment
• Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures)
• Drive design decisions through close collaboration with SI/PI, mechanical, and SOC teams

Cross-Functional Collaboration

• Partner with internal engineering teams, OSATs, and substrate suppliers to deliver optimized solutions
• Interface with stakeholders to communicate design status, risks, and mitigation strategies
• Contribute to design reviews, signoff readiness, and tapeout processes

Methodology & Continuous Improvement

• Define and enhance package design methodologies, flows, and best practices
• Drive improvements in layout efficiency, reuse, and design standardization
• Mentor junior engineers and promote engineering excellence across the team

Preferred Experiences

• Minimum 8+ years of experience in designing complex substrate design or Silicon Bridge or Interposers
• Proven ability to execute in multi-project, fast-phased, and high-pressure environments
• Strong experience in advanced packaging technologies:
  • 2.5D / 3D integration (e.g., interposers, chiplets)
• Hands-on experience with EDA tools such as:
  • Cadence SIP / APD
  • Synopsys 3DICC or equivalent
• Experience working with OSATs, foundries, and substrate vendors
• Solid understanding of Signal Integrity and Power Integrity fundamentals

Academic Credentials

• Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, or related field

Location

Singapore

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.