Senior Packaging Design Engineer AI-Driven 2.5D/3D

AMD; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

AMD is seeking an experienced SMTS Package Design Engineer in Singapore to lead end-to-end package design execution for advanced products. You will work closely with SI/PI, mechanical, and SOC teams, applying AI-driven design techniques, automation, and next-generation workflows to address complex packaging challenges.

The role requires strong ownership across programs, ability to thrive in a fast-paced environment, and mentoring of junior engineers.

Qualifications

• Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, or related field

Responsibilities

• Lead end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets are met
• Handle multiple concurrent design programs in a fast-paced, high-pressure environment
• Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures)
• Drive design decisions through close collaboration with SI/PI, mechanical, and SOC teams
• Partner with internal engineering teams, OSATs, and substrate suppliers to deliver optimized solutions
• Interface with stakeholders to communicate design status, risks, and mitigation strategies
• Contribute to design reviews, signoff readiness, and tapeout processes
• Define and enhance package design methodologies, flows, and best practices
• Drive improvements in layout efficiency, reuse, and design standardization
• Mentor junior engineers and promote engineering excellence across the team
• Experience in designing complex substrate design or Silicon Bridge or Interposers

Job description

AMD is seeking an experienced SMTS Package Design Engineer in Singapore to lead end-to-end package design execution for advanced products. You will work closely with SI/PI, mechanical, and SOC teams, applying AI-driven design techniques, automation, and next-generation workflows to address complex packaging challenges.

The role requires strong ownership across programs, ability to thrive in a fast-paced environment, and mentoring of junior engineers.