Senior Packaging Design Lead - AI-Driven 2.5D/3D

AMD; Singapore; On-site; SGD 90,000 - 150,000; Full time

Benefits offered by this job

AMD benefits

Job summary

AMD Singapore is seeking a highly experienced SMTS Package Design Engineer to lead end-to-end package design for complex products. The role requires delivering high-quality designs using AI-driven methods and coordinating with SI/PI, mechanical, and SOC teams.

You will mentor junior engineers and drive improvements in packaging methodologies, leveraging AI, automation, and next-generation workflows in a fast-paced environment.

Qualifications

• Experience in designing complex substrate designs or interposers.
• Ability to execute in multi-project, fast-paced environments.
• Strong experience in advanced packaging technologies.

Responsibilities

• Lead end-to-end package design execution for complex products, meeting performance, cost, quality, and schedule targets.
• Develop substrate layouts, bump maps, and interposer designs for 2.5D/3D packaging.
• Drive design decisions with SI/PI, mechanical, and SOC teams.
• Mentor junior engineers and promote engineering excellence.

Skills

Package design

AI-driven design

Multi-project leadership

Signal integrity

Power integrity

Cross-functional teamwork

EDA tools

Education

Bachelor’s or higher in Electrical/Computer Engineering

Tools

EDA tools

OSAT coordination

Job description

AMD Singapore is seeking a highly experienced SMTS Package Design Engineer to lead end-to-end package design for complex products. The role requires delivering high-quality designs using AI-driven methods and coordinating with SI/PI, mechanical, and SOC teams.

You will mentor junior engineers and drive improvements in packaging methodologies, leveraging AI, automation, and next-generation workflows in a fast-paced environment.