Senior AI-Driven Packaging Engineer (2.5D/3D)

Advanced Micro Devices; Singapore; On-site; SGD 120,000 - 180,000; Full time

Benefits offered by this job

AMD benefits at a glance

Job summary

Advanced Micro Devices in Singapore seeks an experienced Package Design Engineer to lead end‑to‑end packaging design for complex products. You will apply AI-driven design techniques and automation to address heterogeneous integration challenges, delivering high‑quality, scalable solutions.

The ideal candidate will own multiple design programs, mentor junior engineers, and collaborate with OSATs, foundries, and substrate vendors to optimize layouts and performance.

Qualifications

• Bachelor’s degree in Electrical or Computer Engineering or a related field.
• Experience with complex substrate/silicon bridge/interposers is preferred.
• Knowledge of Signal Integrity and Power Integrity fundamentals is desired.

Responsibilities

• Lead end‑to‑end package design execution for complex products with targets for performance, cost, quality and schedule.
• Manage multiple concurrent design programs in a fast‑paced, high‑pressure environment.
• Develop substrate layouts, bump maps, and interposer designs for 2.5D/3D packaging and chiplet architectures.
• Collaborate closely with SI/PI, mechanical, and SOC teams to drive design decisions.

Skills

Ownership & accountability

Fast-phase execution

AI/ML for design

Automation in design

Cross-functional collaboration

Strong communication

Education

Bachelor’s degree in Electrical or Computer Engineering

Tools

EDA tools (Cadence, Synopsys)

Job description

Advanced Micro Devices in Singapore seeks an experienced Package Design Engineer to lead end‑to‑end packaging design for complex products. You will apply AI-driven design techniques and automation to address heterogeneous integration challenges, delivering high‑quality, scalable solutions.

The ideal candidate will own multiple design programs, mentor junior engineers, and collaborate with OSATs, foundries, and substrate vendors to optimize layouts and performance.