Packaging Design Lead — AI-Driven 2.5D/3D Advanced Packaging

Advanced Micro Devices (S) Pte Ltd; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

AMD Singapore is seeking a highly experienced Package Design Engineer to lead end-to-end package design for advanced 2.5D/3D architectures and chiplet-based products. You will drive complex design execution with speed, accuracy, and scalability in a fast-paced environment.

The role emphasizes AI-driven design techniques, automation, collaboration with SI/PI, mechanical, and SOC teams, and mentoring junior engineers while raising design standards across the organization.

Qualifications

• Experienced in package or silicon physical design.
• Proven ownership across multiple programs.
• Ability to apply AI/ML and automation to improve design productivity.
• Strong collaboration and communication skills.

Responsibilities

• Lead end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets are met.
• Handle multiple concurrent design programs in a fast-paced and high-pressure environment.
• Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures).
• Drive design decisions through close collaboration with SI/PI, mechanical, and SOC teams.

Skills

Ownership

Fast-paced

AI/ML

Autonomy

Collaboration

Education

Bachelor's or higher in Electrical/Computer Engineering

Job description

AMD Singapore is seeking a highly experienced Package Design Engineer to lead end-to-end package design for advanced 2.5D/3D architectures and chiplet-based products. You will drive complex design execution with speed, accuracy, and scalability in a fast-paced environment.

The role emphasizes AI-driven design techniques, automation, collaboration with SI/PI, mechanical, and SOC teams, and mentoring junior engineers while raising design standards across the organization.