Senior Packaging Engineer - AI-Powered 2.5D/3D Design

Advanced Micro Devices (S) Pte Ltd; Singapore; On-site; SGD 120,000 - 160,000; Full time

Job summary

Advanced Micro Devices (AMD) is seeking a highly experienced SMTS Package Design Engineer to support complex package design execution, leveraging AI-driven design techniques, automation, and next-generation workflows to tackle heterogenous integration.

You will own end-to-end package design, mentor juniors, collaborate with OSATs, foundries, and internal teams, and help drive design reviews and tapeouts in a fast-paced environment.

Qualifications

• Experience in designing complex substrate design, Silicon Bridge or Interposers.
• Proven ability to execute in multi-project, fast-phased, high-pressure environments.
• Strong experience in advanced packaging technologies.
• Hands-on experience with EDA tools.
• Experience working with OSATs, foundries, and substrate vendors.
• Solid understanding of Signal Integrity and Power Integrity fundamentals.

Responsibilities

• Lead end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets.
• Handle multiple concurrent design programs in a fast-paced and high-pressure environment.
• Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures).
• Drive design decisions through close collaboration with SI/PI, mechanical, and SOC teams.

Skills

Package design

AI/ML in design

Automation

Cross-functional collaboration

SI/PI fundamentals

Education

Bachelor’s or higher in Electrical/Computer Engineering or related field

Tools

EDA tools

Job description

Advanced Micro Devices (AMD) is seeking a highly experienced SMTS Package Design Engineer to support complex package design execution, leveraging AI-driven design techniques, automation, and next-generation workflows to tackle heterogenous integration.

You will own end-to-end package design, mentor juniors, collaborate with OSATs, foundries, and internal teams, and help drive design reviews and tapeouts in a fast-paced environment.