Senior Packaging Design Lead AI-Driven 2.5D/3D Interposers

ADVANCED MICRO DEVICES (SINGAPORE) PTE LTD; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

AMD Singapore is seeking an experienced SMTS Package Design Engineer to drive complex package design execution and deliver high-quality designs with speed and precision.

The role emphasizes ownership, cross-functional collaboration, and applying AI/ML to improve productivity in advanced packaging technologies (2.5D/3D, chiplet-based). This is a high-performance, fast-paced environment with leadership opportunities.

Qualifications

• Demonstrates ownership across multiple programs.
• Thrives in fast-paced, high-pressure environments.
• Applies AI/ML and automation to improve design productivity.
• Collaborates with SI/PI, mechanical and SOC teams.
• Maintains strong communication skills across teams.
• Bachelor's or higher in Electrical/Computer Engineering or related field.

Responsibilities

• Lead end-to-end package design execution for complex products.
• Handle multiple concurrent design programs in fast-paced settings.
• Develop substrate layouts, bump maps, and interposer designs (2.5D/3D, chiplet-based).
• Drive design decisions with cross-functional teams and reviews.

Skills

Ownership

Fast-phase execution

AI/ML in design

Automation

Cross-functional collaboration

Education

Electrical/Computer Engineering degree

Job description

AMD Singapore is seeking an experienced SMTS Package Design Engineer to drive complex package design execution and deliver high-quality designs with speed and precision.

The role emphasizes ownership, cross-functional collaboration, and applying AI/ML to improve productivity in advanced packaging technologies (2.5D/3D, chiplet-based). This is a high-performance, fast-paced environment with leadership opportunities.