Senior MEMS Packaging Engineer - High-Yield NPI

SiTime; Singapore; On-site; SGD 100,440 - 167,400; Full time

Job summary

SiTime in Singapore seeks a Packaging Process Engineer to develop, optimize, and sustain advanced packaging processes for WLCSP, including bumping, RDL, underfill and dicing. You will partner with R&D, design, equipment, and manufacturing teams to ensure smooth transfer from development to high‑volume production.

The role emphasizes process capability, SPC, SOPs, and ongoing improvements to yield, quality, and cost efficiency, with opportunities for quarterly bonuses tied to innovation goals.

Qualifications

• Experience in packaging processes and WLCSP technologies.
• Familiarity with manufacturing metrics and SPC is a plus.
• Ability to collaborate across R&D, design, and manufacturing teams.

Responsibilities

• Develop, optimize, and qualify WLCSP packaging processes (bumping, RDL, underfill, dicing).
• Perform root cause analysis and implement 8D corrective actions.
• Collaborate with cross‑functional teams to transfer processes to high‑volume manufacturing.
• Lead or participate in NPI and process improvement projects.
• Evaluate new materials, equipment, and processes to support roadmaps.
• Stay updated with trends in packaging technologies.

Skills

Process optimization

Materials knowledge

Quality compliance (GMP)

Job description

SiTime in Singapore seeks a Packaging Process Engineer to develop, optimize, and sustain advanced packaging processes for WLCSP, including bumping, RDL, underfill and dicing. You will partner with R&D, design, equipment, and manufacturing teams to ensure smooth transfer from development to high‑volume production.

The role emphasizes process capability, SPC, SOPs, and ongoing improvements to yield, quality, and cost efficiency, with opportunities for quarterly bonuses tied to innovation goals.