Senior Wafer Bumping & NPI Process Engineer

Lumilens; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

Lumilens in Singapore seeks an experienced process development engineer to lead wafer bumping and Fan-Out packaging for silicon photonic chip wafers. You will design early-stage process flows, optimize key steps, and work with OSAT or internal lines to ensure manufacturability.

The role requires 5+ years in wafer bumping or related packaging, hands-on lithography, sputtering, electroplating, and DOE. You will drive reliability tests, root-cause analysis, and documentation for NPI and process

Qualifications

• Bachelor or Master in a technical discipline with 5+ years in wafer bumping or fan-out packaging.
• Hands-on experience with lithography, sputtering, electroplating, and ball drop.
• Familiarity with SEM/CSAM and cross-sectioning for root-cause analysis.
• Strong DOE, reliability testing, and SPC knowledge.
• Experience in OSAT or IDM advanced packaging lines.

Responsibilities

• Lead process development and technical support for wafer bumping and fan-out processes.
• Design and execute DOE to characterize process windows and margins.
• Evaluate materials and qualification of new chemistries.
• Lead reliability validations including TCT, HAST, HTS.
• Manage documentation: SOPs, WI, FMEA, ECOs.

Skills

Wafer bumping

Fan-Out process

Process integration

DOE

Materials characterization

Reliability testing

Failure analysis

SPC

Cross-sectioning

Python

Education

Bachelor's or Master's in Materials Science / Chemical Engineering / Mechanical Engineering

Tools

JMP

Minitab

Python

Job description

Lumilens in Singapore seeks an experienced process development engineer to lead wafer bumping and Fan-Out packaging for silicon photonic chip wafers. You will design early-stage process flows, optimize key steps, and work with OSAT or internal lines to ensure manufacturability.

The role requires 5+ years in wafer bumping or related packaging, hands-on lithography, sputtering, electroplating, and DOE. You will drive reliability tests, root-cause analysis, and documentation for NPI and process