Wafer Packaging Process Engineer - Yield Focus

Qualcomm; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

Qualcomm in Singapore is looking for a motivated Process Engineer to support backend semiconductor packaging operations. The role involves providing engineering support for various processes including wafer bumping and singulation, and driving improvements in productivity and quality.

The candidate must have a Bachelor’s Degree in Engineering, with preferred experience in semiconductor manufacturing. Strong data analysis and problem-solving skills are essential.

Qualifications

• Bachelor's degree in Engineering, preferably in Mechanical, Materials, Chemical, Manufacturing, or a related discipline.
• At least 2 years of relevant working experience as a Process Engineer in semiconductor assembly or backend manufacturing.

Responsibilities

• Provide engineering support for backend semiconductor packaging processes.
• Support daily production activities to achieve output and quality goals.
• Monitor and analyze process data to identify improvement opportunities.
• Lead troubleshooting and problem-solving activities for production issues.
• Maintain relevant documentation for processes and standards.

Skills

Data analysis

Problem-solving

Communication skills

Collaboration skills

Proficient in Microsoft PowerPoint

Proficient in Microsoft Excel

Proficient in Microsoft Word

Education

Bachelor's Degree in Engineering or related field

Tools

Statistical Process Control (SPC)

Measurement System Analysis (MSA)

Job description

Qualcomm in Singapore is looking for a motivated Process Engineer to support backend semiconductor packaging operations. The role involves providing engineering support for various processes including wafer bumping and singulation, and driving improvements in productivity and quality.

The candidate must have a Bachelor’s Degree in Engineering, with preferred experience in semiconductor manufacturing. Strong data analysis and problem-solving skills are essential.