Wafer Packaging Process Engineer — Elevate Yield & Quality

SILICON BOX PTE. LTD.; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

SILICON BOX PTE. LTD. in Singapore seeks a hands-on engineer to drive wafer-level packaging process improvements across Wet, PVD, Lithography or AOI stages. You will lead SPC, DOE, FEMA, and 8D reporting, and support transitions from pilot to full production.

The role requires cross-functional collaboration, strong problem-solving skills, and a Bachelor’s degree in a relevant engineering field to achieve optimized yield and cycle times.

Qualifications

• Bachelor’s degree in a relevant engineering field.
• 至少 3 years hands-on process experience in Wafer-level Fanout packaging or LCD/FPD production lines.
• Knowledge in process engineering, process control engineering and yield enhancement.

Responsibilities

• Review and accept machine buyoff, set up pilot line process and transfer to production line.
• Establish, review and update specifications, workflow, quality and safety documentation for production line.
• Troubleshoot process issues and improve capabilities, yield and cycle time from NPI to LVM/HVM stages.
• Lead process control measures such as SPC, FDC/KPC and RCA toward zero defects.

Skills

Process engineering

yield enhancement

SPC

FEMA

8D reports

Education

Bachelor’s degree in Chemical, Materials Science, Microelectronics, Mechanical Engineering

Tools

DOE

Job description

SILICON BOX PTE. LTD. in Singapore seeks a hands-on engineer to drive wafer-level packaging process improvements across Wet, PVD, Lithography or AOI stages. You will lead SPC, DOE, FEMA, and 8D reporting, and support transitions from pilot to full production.

The role requires cross-functional collaboration, strong problem-solving skills, and a Bachelor’s degree in a relevant engineering field to achieve optimized yield and cycle times.