Senior Front-End Packaging & Chip Interaction Engineer

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 70,000 - 90,000; Full time

Job summary

A global semiconductor leader in Singapore is seeking a Front End Central Product Integration Engineer to drive yield and quality improvements for silicon node packaging. The role requires a Bachelor’s or Master's degree in a relevant field and at least 2 years of experience in semiconductor processing. Key responsibilities include leading project teams, defining integration strategies, and maintaining technical expertise. This position involves some travel (20–50%) for collaboration at various fab locations.

Qualifications

• Minimum of 2 years of experience in BEOL semiconductor processing or process integration.
• Knowledge in Semiconductor Device Physics and wafer fabrication process flows.
• Demonstrated teamwork skills with focus on developing good team dynamics.

Responsibilities

• Promote worldwide synergy for improved benchmark performance through global project management.
• Define strategies for Packaging Technology qualification ahead of product qualification.
• Lead teams to address yield and quality challenges timely.

Skills

Data analysis

Troubleshooting

Presentation skills

Interpersonal skills

Organizational capabilities

Communication skills

Multi-tasking

Education

Bachelor’s or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science/Engineering or related field

Tools

Microsoft Office

Job description

A global semiconductor leader in Singapore is seeking a Front End Central Product Integration Engineer to drive yield and quality improvements for silicon node packaging. The role requires a Bachelor’s or Master's degree in a relevant field and at least 2 years of experience in semiconductor processing. Key responsibilities include leading project teams, defining integration strategies, and maintaining technical expertise. This position involves some travel (20–50%) for collaboration at various fab locations.