Senior Front-End Engineer for AI-Driven Packaging & Yield

Micron

Singapore

On-site

SGD 120,000 - 180,000

Full time

14 days+

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Job summary

Micron Technology, Inc. in Singapore seeks a Senior Engineer to drive Packaging Product yield, quality improvement, and NPI through engineering excellence. You will apply AI-enabled analytics and lead cross-functional teams to accelerate problem solving and innovation.

Travel to Micron Fab locations as needed, contributing to product yield improvements and BEOL/packaging integration. Requires 5 years in semiconductor device physics and related areas, plus strong data analysis and communication

Qualifications

Bachelor’s or Master’s degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science Engineering or related field.
5 years relevant experience in Semiconductor Device Physics, DRAM operations, wafer fabrication, parametric tests and yield.
3 years experience on DRAM High Performance Memory, BEOL integration, advanced packaging and layout.
Strong data analysis, troubleshooting, and presentation skills in Semiconductor Industry.

Responsibilities

Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management.
Define strategies to ensure Packaging Technology and Front End interaction are developed and qualified early.
Lead the PI Loop taskforce to address yield and quality challenges and optimize process flow.
Maintain domain knowledge and explore innovation opportunities with strategic thinking.
Travel to Micron Fab locations as necessary for face-to-face work.