Senior Front-End Engineer for AI-Driven Packaging & Yield

Micron; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks a Senior Engineer to drive Packaging Product yield, quality improvement, and NPI through engineering excellence. You will apply AI-enabled analytics and lead cross-functional teams to accelerate problem solving and innovation.

Travel to Micron Fab locations as needed, contributing to product yield improvements and BEOL/packaging integration. Requires 5 years in semiconductor device physics and related areas, plus strong data analysis and communication

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science Engineering or related field.
• 5 years relevant experience in Semiconductor Device Physics, DRAM operations, wafer fabrication, parametric tests and yield.
• 3 years experience on DRAM High Performance Memory, BEOL integration, advanced packaging and layout.
• Strong data analysis, troubleshooting, and presentation skills in Semiconductor Industry.

Responsibilities

• Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management.
• Define strategies to ensure Packaging Technology and Front End interaction are developed and qualified early.
• Lead the PI Loop taskforce to address yield and quality challenges and optimize process flow.
• Maintain domain knowledge and explore innovation opportunities with strategic thinking.
• Travel to Micron Fab locations as necessary for face-to-face work.

Skills

Data analysis

Troubleshooting

Problem solving

Verbal communication

Written communication

Teamwork

Organizational skills

Interpersonal skills

Multi-tasking

Microsoft Office

AI-enabled productivity tools

Presentation skills

Education

Bachelor’s or Master’s degree in Electrical Engineering or related field

Tools

Microsoft Copilot

Data analytics software

Job description

Micron Technology, Inc. in Singapore seeks a Senior Engineer to drive Packaging Product yield, quality improvement, and NPI through engineering excellence. You will apply AI-enabled analytics and lead cross-functional teams to accelerate problem solving and innovation.

Travel to Micron Fab locations as needed, contributing to product yield improvements and BEOL/packaging integration. Requires 5 years in semiconductor device physics and related areas, plus strong data analysis and communication