Senior Engineer, AI-Driven Packaging Integration (APTD/CEM)

Micron Technology, Inc

Singapore

On-site

SGD 120,000 - 180,000

Full time

14 days+
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Job summary

Micron Technology, Inc. in Singapore seeks an Senior Engineer for APTD CEM to advance packaging integration for high-performance memory products. You will develop post-fab packaging, enable AI-assisted insights, and work with Process, Product, and Quality teams to achieve yield and cost goals.

The role emphasizes data analytics, cross-functional leadership, and smooth technology transfer from development to high-volume production, with global collaboration and strict quality controls.

Qualifications

  • PhD with or Master’s degree with ≥3 years, or Bachelor’s degree with ≥5 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.
  • Semiconductor process integration experience; know-how to develop advanced package technology for post-fab wafer finish and assembly.
  • Proficiency in Python, R, SQL; experience with automation tools.

Responsibilities

  • Develop and enable advanced package technology for post-fab wafer finish and assembly processes.
  • Improve product quality, drive yield improvements, reduce costs, and enhance productivity.
  • Integrate semiconductors while partnering with process and product engineering teams to drive improvements.
  • Provide POR/MOR documentation for product transfer to high volume manufacturing.

Skills

Python
R
SQL
Visual Basic

Education

Master's degree in EE/related field
PhD in related field (preferred)
Bachelor's degree with ≥5 years experience

Tools

E3
FDC
RMS

Job description

Micron Technology, Inc. in Singapore seeks an Senior Engineer for APTD CEM to advance packaging integration for high-performance memory products. You will develop post-fab packaging, enable AI-assisted insights, and work with Process, Product, and Quality teams to achieve yield and cost goals.

The role emphasizes data analytics, cross-functional leadership, and smooth technology transfer from development to high-volume production, with global collaboration and strict quality controls.

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