Senior Front-End Engineer: AI-Driven Packaging & Yield

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Semiconductor Asia Operations Pte Ltd in Singapore is seeking a Senior Engineer to drive packaging product yield improvements and NPI through technical excellence and cross-functional collaboration.

The role emphasizes AI-enabled engineering, data analytics, and digital tools to accelerate problem solving, improve productivity, and enhance decision quality across yield, quality, and business processes. Travel to Micron Fab locations will be required.

Qualifications

• Bachelor’s or Master’s in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science Engineering or related field.
• 5 years in Semiconductor Device Physics, DRAM operations, wafer fabrication, parametric/electrical test and probe yield.
• 3 years in DRAM High Performance Memory, BEOL integration, advanced packaging and layout.
• Strong data analysis, troubleshoot, problem solving, reporting and presentation skills in semiconductor industry.
• Good multi-tasking, verbal and written communication skills.
• Strong interpersonal skills and teamwork with cross-functional collaboration.
• Good organizational capabilities and ability to work with minimal supervision.
• Proficiency in MS Office, AI-enabled productivity tools, and digital collaboration platforms.

Responsibilities

• Promote worldwide synergy via global project management and re-engineering of business processes.
• Define strategies for Packaging Technology and Front-End integration well ahead of product qualification.
• Lead PI Loop taskforce in network to address yield and quality challenges.
• Maintain domain knowledge and explore innovation opportunities with strategic thinking.
• Present project updates to small and large groups on initiatives.
• Travel to Micron Fab locations as necessary for face-to-face work.
• Drive AI and digital transformation to improve engineering efficiency and decision making.

Skills

Data analysis

Troubleshooting

Problem solving

Reporting

Presentation skills

Verbal/written communication

Teamwork

Organizational skills

AI & analytics fluency

Education

Electrical Eng / Microelectronics

Tools

Microsoft Office

AI Copilot tools

Digital collaboration platforms

Job description

Micron Semiconductor Asia Operations Pte Ltd in Singapore is seeking a Senior Engineer to drive packaging product yield improvements and NPI through technical excellence and cross-functional collaboration.

The role emphasizes AI-enabled engineering, data analytics, and digital tools to accelerate problem solving, improve productivity, and enhance decision quality across yield, quality, and business processes. Travel to Micron Fab locations will be required.