Advanced Packaging Metrology Engineer: AI-Driven Yield

Micron Technology, Inc.; Singapore; On-site; SGD 120,000 - 190,000; Full time

Job summary

Micron Technology, Inc. is seeking an Advanced Packaging Metrology-RDA Engineer to join the Advanced Packaging Technology Development team in Singapore.

You will develop metrology and AI-enabled inspection methods, diagnose yield issues, and coordinate with multiple groups to deploy new technologies that improve reliability and performance. You will contribute to process optimization, data-driven decisions, and long-range metrology strategy while ensuring compliance and quality across packaging

Qualifications

• Educational degrees in engineering or physics related fields.
• 2+ years in semiconductor process or equipment engineering.
• Proficient in Python, R, SQL for analytics and modeling.
• Experience with automation tools like Visual Basic.
• Familiar with E3, FDC, RMS for control and data handling.
• Strong data analytics to support SPC, DOE, defect analysis.
• Understanding of process flows and yield impact.
• Hands-on with metrology/RDA systems and wafer tooling.
• Ability to work under timelines and drive root-cause analysis.
• AI literacy and responsible use of AI tools.

Responsibilities

• Develop and optimize metrology recipes for semiconductor processes.
• Establish inspection methodologies and best-known methods (BKM).
• Perform in-line characterization and validation of recipes.
• Analyze data with tools to report progress and opportunities.
• Own metrology tools and drive SPC charts and control plans.
• Collaborate with Package Integration and Fab teams to integrate processes.
• Apply AI-assisted tools to improve efficiency and quality.

Skills

Python

R

SQL

Data analytics

AI literacy

Problem solving

Education

B.S./M.S./Ph.D. in Mechanical Engineering

B.S./M.S./Ph.D. in Chemical Engineering

B.S./M.S./Ph.D. in Electrical Engineering

B.S./M.S./Ph.D. in Physics

Related technical fields

Tools

Visual Basic

E3

FDC

RMS

Metrology/RDA systems

Wafer/assembly tools

Job description

Micron Technology, Inc. is seeking an Advanced Packaging Metrology-RDA Engineer to join the Advanced Packaging Technology Development team in Singapore.

You will develop metrology and AI-enabled inspection methods, diagnose yield issues, and coordinate with multiple groups to deploy new technologies that improve reliability and performance. You will contribute to process optimization, data-driven decisions, and long-range metrology strategy while ensuring compliance and quality across packaging