Senior Flip-Chip BGA Package Design Engineer

AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Broadcom is seeking an experienced package design engineer for complex flip‑chip‑BGA packages used in AI, networking, HPC, and 5G base stations. You will lead high-frequency structures, ensure SI/PI, and collaborate with a global R&D team across multiple projects.

The role requires 5+ years in flip‑chip‑BGA design (or 3+ for M.Eng) and proficiency with SI/PI concepts and Cadence APD. Strong organizational skills are essential for multi-project execution.

Qualifications

• B.Eng (EE/EEE) or similar field with 5+ years’ experience in flip‑chip‑BGA package design, including high-speed SerDes
• M.Eng (EE/EEE) or similar field with 3+ years’ experience in flip‑chip‑BGA package design, including high-speed SerDes
• Knowledge of package‑level signal integrity and power integrity to apply to package designs
• Cadence APD (Allegro package designer) experience is preferred. Equivalent tools will also be considered.
• Cooperate with our world‑wide team (multiple time zones), including co‑design with internal team members and external (Vendor) designers.
• Good organizational and task management skills to manage multiple package design projects.

Responsibilities

• Overall design responsibility for ASIC package designs (layout/routing), including aspects of impedance matching, crosstalk, signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
• Package Design of critical high frequency/datarate structures for SerDes, ADC/DAC, DDR, HBM, etc.
• Schedule, prioritize, & track your work across multiple projects simultaneously
• General flip-chip BGA package design & engineering

Skills

High-speed SerDes

Multinational collaboration

Organizational skills

Education

B.Eng (EE/EEE) or similar field

M.Eng (EE/EEE) or similar field

Tools

Cadence APD (Allegro package designer)

Job description

Broadcom is seeking an experienced package design engineer for complex flip‑chip‑BGA packages used in AI, networking, HPC, and 5G base stations. You will lead high-frequency structures, ensure SI/PI, and collaborate with a global R&D team across multiple projects.

The role requires 5+ years in flip‑chip‑BGA design (or 3+ for M.Eng) and proficiency with SI/PI concepts and Cadence APD. Strong organizational skills are essential for multi-project execution.