Flip-Chip Process Engineer: Yield, Packaging & Innovation

Nutanix

Singapore

On-site

SGD 90,000 - 140,000

Full time

14 days+
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Job summary

Qualcomm seeks a Hardware Engineer to plan, design, verify, and test electronic systems for backend semiconductor packaging. You will support flip chip bonding, reflow soldering, and plasma cleaning while analyzing data to drive improvements and coordinate with production, quality, and planning teams.

The role emphasizes problem solving, process optimization, and ensuring readiness for production, with a focus on safety, quality, and continuous improvement.

Qualifications

  • Bachelor’s Degree in Engineering required.
  • Strong data analysis, problem solving and critical thinking.
  • Good communication and collaboration skills; cross-functional teamwork beneficial.

Responsibilities

  • Provide engineering support for backend semiconductor packaging processes, including flip chip bonding, reflow soldering and plasma cleaning.
  • Monitor and analyze process data to identify trends, risks, and improvement opportunities.
  • Lead troubleshooting and problem-solving activities for process abnormalities, yield loss, quality excursions, and production issues.
  • Drive permanent corrective and preventive actions to resolve chronic process and quality issues.
  • Evaluate new products, materials, and processes during pilot runs and ensure process readiness for production release.
  • Work closely with production, equipment, quality, planning, and cross-functional teams to ensure smooth manufacturing execution.
  • Maintain Work Instructions, Control Plans, FMEA, and Process Control documents; support audits.

Skills

Data analysis
Problem solving
Critical thinking
Communication
Collaboration
MS PowerPoint
MS Excel
MS Word
SPC
MSA

Education

Bachelor’s Degree in Engineering

Tools

SPC
MSA

Job description

Qualcomm seeks a Hardware Engineer to plan, design, verify, and test electronic systems for backend semiconductor packaging. You will support flip chip bonding, reflow soldering, and plasma cleaning while analyzing data to drive improvements and coordinate with production, quality, and planning teams.

The role emphasizes problem solving, process optimization, and ensuring readiness for production, with a focus on safety, quality, and continuous improvement.

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