Package Design Engineer

Broadcom Inc.; Singapore; On-site; SGD 150,000 - 210,000; Full time

Job summary

Broadcom Inc. is seeking an experienced package design engineer to develop complex flip-chip-BGA packages for ASICs used in AI, networking, HPC, and 5G.

You will help enable high-performance SerDes at 200G and above, RF/microwave ADC/DAC, DDR, and HBM through careful layout, impedance matching, and thermal management. You will work with a worldwide R&D team across time zones, own design from concept through validation, and collaborate with internal and external designers using Cadence APD or

Qualifications

• Requires a B.Eng in EE/EEE or similar with 5+ years in flip-chip-BGA design.
• Experience with high-speed SerDes and package-level SI/PI.
• Knowledge of Cadence APD preferred; equivalent tools considered.

Responsibilities

• Own ASIC flip-chip BGA package design, including impedance, crosstalk, and thermal aspects.
• Design high-frequency structures for SerDes, DDR and HBM as part of ASIC packages.
• Schedule and track multiple packages across time zones with internal/external teams.
• Collaborate with global teams including external vendors.

Skills

High-speed SerDes

Signal integrity

Power integrity

Cross-functional collaboration

Education

B.Eng (EE/EEE) or similar

M.Eng (EE/EEE) or similar (preferred)

Tools

Cadence APD

Allegro

Job description

Job Description: Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D-D/A converters (ADC & DAC). You will be part of a worldwide R&D team developing high-performance package designs for ASICs used in artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 200G and higher, RF/Microwave ADC/DAC, DDR, HBM, and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design.

RESPONSIBILITIES:

• Overall design responsibility for ASIC package designs (layout/routing), including aspects of impedance matching, crosstalk, signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
• Package Design of critical high frequency/datarate structures for SerDes, ADC/DAC, DDR, HBM, etc.
• Schedule, prioritize, & track your work across multiple projects simultaneously
• General flip-chip BGA package design & engineering

EDUCATION/EXPERIENCE & REQUIREMENTS:

B.Eng (EE/EEE) or similar field and 5+ years’ experience in flip-chip-BGA package design, including high-speed SerDes M.Eng (EE/EEE) or similar field and 3+ years’ experience in flip-chip-BGA package design, including high-speed SerDes Knowledge of package-level signal integrity and power integrity, to apply to package designs Cadence APD (allegro package designer) experience is preferred. Equivalent tools will also be considered. Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers. Good organizational and task management skills to manage multiple package design projects.

PREFERRED EDUCATION/EXPERIENCE & REQUIREMENTS:

B.Eng (EE/EEE) or similar field and 8+ years’ experience in flip-chip-BGA package design, including high-speed SerDes preferred. M.Eng (EE/EEE) or similar field and 6+ years’ experience in flip-chip-BGA package design, including high-speed SerDes preferred. Experience with 2.5D and 3DIC packages is highly advantageous.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

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