Senior Engineer, HBM Product & Test Innovation

Micron

Singapore

On-site

SGD 120,000 - 180,000

Full time

3 days ago
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Job summary

Micron is seeking a key technical contributor in the High Bandwidth Memory (HBM) Product Engineering - Media Health team to drive manufacturing test flow and yield improvements for next-generation HBM products.

You will collaborate with Fab, Design Engineering, Technology Development, and Quality/Reliability teams to optimize test coverage, validate new devices, and reduce cycle times while advancing cost competitiveness and product reliability.

Qualifications

  • Experience in semiconductor devices, circuit design, or product validation.
  • Strong problem-solving and root-cause analysis skills.
  • Familiarity with CMOS technology, DRAM architecture, and device physics.
  • Exposure to data analytics and interpretation.

Responsibilities

  • Optimized test coverage across current and future HBM architectures and process nodes.
  • Develop, validate, characterize, and qualify Micron's next-generation HBM products.
  • Support design validation for new products using CAD tools and Verilog simulations.
  • Improve manufacturing test yields and reduce test time; resolve yield-related issues.
  • Collaborate with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams.
  • Promote innovation and use AI-powered tools to boost productivity.

Skills

Semiconductor devices
Circuit design
Product validation
CMOS technology
DRAM architecture
Data analytics

Education

Bachelor's or Master's degree in Electrical and Electronics Engineering or related

Tools

CAD tools
Verilog simulations

Job description

Micron is seeking a key technical contributor in the High Bandwidth Memory (HBM) Product Engineering - Media Health team to drive manufacturing test flow and yield improvements for next-generation HBM products.

You will collaborate with Fab, Design Engineering, Technology Development, and Quality/Reliability teams to optimize test coverage, validate new devices, and reduce cycle times while advancing cost competitiveness and product reliability.

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